| |
S. |
Agrawal |
University of Delaware |
USA |
|
| |
I. |
Bonev |
Ecole de Technologie Supérieure |
Canada |
|
| |
M. |
Ceccarelli |
University of Cassino |
Italy |
|
| |
I-M. |
Chen |
Nanyang Technological University |
Singapore |
|
| |
J.S. |
Dai |
King's College London |
UK |
|
| |
G. |
Gogu |
Institut Français de Mécanique Avancée |
France |
|
| |
J. |
Herder |
Delft University of Technology |
Netherlands |
|
| |
J. |
Hesselbach |
Technical University of Braunschweig |
Germany |
|
| |
M. |
Hiller |
University of Duisburg-Essen |
Germany |
|
| |
T. |
Huang |
Tianjin University |
China |
|
| |
Z. |
Huang |
Yanshan University |
China |
|
| |
M. |
Husty |
University Innsbruck |
Austria |
|
| |
P. |
Larochelle |
Florida Institute of Technology |
USA |
|
| |
J.M. |
McCarthy |
University of California at Irvine |
USA |
|
| |
V. |
Parenti-Castelli |
University of Bologna |
Italy |
|
| |
M. |
Shoham |
Israel Institute of Technology |
Israel |
|
| |
Y. |
Takeda |
Tokyo Institute of Technology |
Japan |
|
| |
F. |
Thomas |
Technical University of Catalonia |
Spain |
|
| |
M. |
Uchiyama |
Tohoku University |
Japan |
|
| |
P. |
Wenger |
Institut de Recherche en Communications et Cybernétique
de Nantes |
France |
|