Journal Papers

    [J26] L. Zhang, E. Deng, H. Cai, Y. Wang, L. Torres, A. Todri-Sanial, Y. Zhang, “A high-reliability and low-power computing-in-memory implementation within STT-MRAM,” Microelectronics Journal 2018, ISSN 0026-2692, doi: https://doi.org/10.1016/j.mejo.2018.09.005.

    [J25] R. Chen J. Liang, J. Lee, V. P. Georgiev, R. Ramos, H. Okuno, D. Kalita, Y. Cheng, L. Zhang, R. R. Pandey, S. Amoroso, C. Millar A. Asenov, J, Dijon, A. Todri-Sanial, “Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances - Part I: Pristine MWCNT”, accepted at IEEE Transactions on Electron Devices, 2018, doi: 10.1109/TED.2018.2868421.

    [J24] R. Chen J. Liang, J. Lee, V. P. Georgiev, R. Ramos, H. Okuno, D. Kalita, Y. Cheng, L. Zhang, R. R. Pandey, S. Amoroso, C. Millar A. Asenov, J, Dijon, A. Todri-Sanial, “Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances - Part II: Impact of Charge Transfer Doping”, accepted at IEEE Transactions on Electron Devices, 2018, doi: 10.1109/TED.2018.2868424.

    [J23] J. Lee, S. Berrada, F. Adamu-Lema, H. Carrillo-Nunez, N. Nagy, V. Georgiev, T. Sadi, J. Liang, R. Ramos, D. Kalita, K. Lilienthal, M. Wislicenus, R. Pandey, B. Chen, K, Teo, G. Goncalves, H. Okuno, B. Uhlig, A. Todri-Sanial, J. Dijon, A. Asenov, “Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electro-Thermal Simulation Study,” IEEE Transactions on Electron Devices, 2018, doi: 10.1109/TED.2018.2853550.

    [J22] Y-L. Zhao, J-L. Yang, W-Sh. Zhao, A. Todri-Sanial, Y. Cheng, “Power Supply Noise Aware Task Scheduling on Homogeneous 3D MPSoCs Considering the Thermal Constraint,” accepted at Journal of Computer Science and Technology 33(5): 1-17, September 2018, doi: 10.1007/s11330-015-0000-0.

    [J21] J. Liang, J. Lee, S. Berrada, V. Georgiev, R. R. Pandey, R. Chen, A. Asenov, A. Todri-Sanial, “Atomistic to Circuit-Level Modeling of Doped SWCNT for On-Chip Interconnects,” IEEE Transactions on Nanotechnology, 2018, doi: 10.1109/TNANO.2018.2802320.

    [J20] L. Zhang, Y. Cheng, W. Kang, L. Torres, Y. Zhang, A. Todri-Sanial, W. Zhao, “Addressing the Thermal Issues of STT-MRAM from Compact Modeling to Design Techniques,” IEEE Transactions on Nanotechnology, vol. 17, no. 2, pp. 345-352, March 2018, doi: 10.1109/TNANO.2018.2803340.

    [J19] K. Chakrabarty et al., "Editorial," in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 25, no. 1, pp. 1-20, Jan. 2017. doi: 10.1109/TVLSI.2016.2638578.

    [J18] A. Todri-Sanial, R. Ramos, H. Okuno, J. Dijon, A. Dhavamani, M. Widlicenus, K. Lilienthal, B. Uhlig, T. Sadi, V. Georgiev, A. Asenov, S. Amoroso, A. Pender, A. Brown, C. Millar, F. Motzfeld, B. Gotsmann, J. Liang, G. Goncalves, N. Rupesinghe, K. Teo, "A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits," in IEEE Circuits and Systems Magazine, vol. 17, no. 2, pp. 47-62, Secondquarter 2017. doi: 10.1109/MCAS.2017.2689538.

    [J17] A. Todri-Sanial, S. P. Mohanty, M. Comte, M. Belleville, “Guest Editorial Special Issue on Nanoelectronic Circuit and System Design Methods for the Mobile Computing Era”, Journal of Emerging Technologies in Computing Systems, vol.13, issue. 2, article 12, 2017, doi: 10.1145/3003370.

    [J16] A. Todri-Sanial and Y. Cheng, "A Study of 3-D Power Delivery Networks With Multiple Clock Domains," in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 24, no. 11, pp. 3218-3231, Nov. 2016. doi: 10.1109/TVLSI.2016.2549275.

    [J15] B. Wu, Y. Cheng, J. Yang, A. Todri-Sanial and W. Zhao, "Temperature Impact Analysis and Access Reliability Enhancement for 1T1MTJ STT-RAM," in IEEE Transactions on Reliability, vol. 65, no. 4, pp. 1755-1768, Dec. 2016. doi: 10.1109/TR.2016.2608910.

    [J14] A. Magnani, M. de Magistris, A. Todri-Sanial and A. Maffucci, "Electrothermal Analysis of Carbon Nanotubes Power Delivery Networks for Nanoscale Integrated Circuits," in IEEE Transactions on Nanotechnology, vol. 15, no. 3, pp. 380-388, May 2016. doi: 10.1109/TNANO.2016.2535390.

    [J13] Y. Cheng, A. Todri-Sanial, J. Yang and W. Zhao, "Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect," in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 24, no. 11, pp. 3310-3322, Nov. 2016. doi: 10.1109/TVLSI.2016.2543260.

    [J12] A. Todri-Sanial and S. Bhanja, “Special Issue on Advances in Design of Ultra-Low Power Circuits and Systems in Emerging Technologies,” Guest Editorial, ACM Journal on Emerging Technologies in Computing Systems (ACM JETC), vol.12, no.2, art. 11, Aug 2015. 1550-4832/2015/08-ART11, doi: 10.1145/2756554.

    [J11] A. Todri-Sanial, S. Kundu, P. Girard, A. Bosio, L. Dilillo, A. Virazel, "Globally Constrained Locally Optimized 3-D Power Delivery Networks," IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol.22, no.10, pp.2131-2144, 2014, doi: 10.1109/TVLSI.2013.2283800.

    [J10] G. Tsiligiannis, L. Dilillo, A. Bosio, P. Girard, S. Pravossoudovitch, A. Todri-Sanial, A. Virazel, J. Mekki, M. Brugger, F. Wrobel, F. Saigne, “An SRAM Based Monitor for Mixed-Field Radiation Environments, “IEEE Transactions on Nuclear Science (TNS), vol.61, no.4, pp.1663-1670, 2014. doi: 10.1109/TNS.2014.2299733.

    [J9] G. Tsiligiannis, L. Dilillo, A. Bosio, P. Girard, S. Pravossoudovitch, A. Todri-Sanial, A. Virazel, J. Mekki, M. Brugger, F. Wrobel, F. Saigne, “"Multiple Cell Upset Classification in Commercial SRAMs," IEEE Transactions on Nuclear Science, vol.61, no.4, pp.1747-1754, 2014. doi: 10.1109/TNS.2014.2313742.

    [J8] J. Azevedo, A. Virazel, A. Bosio, L. Dilillo, P. Girard, A. Todri-Sanial, J. Alvarez-Herault, K. Mackay, "A Complete Resistive-Open Defect Analysis for Thermally Assisted Switching MRAMs," IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 22, no. 11, pp. 2326-2335, Nov. 2014. doi: 10.1109/TVLSI.2013.2294080.

    [J7] A. Todri, A. Bosio, L. Dilillo, P. Girard, S. Pravossoudovitch, A. Virazel, “Uncorrelated Power Supply Noise and Ground Bounce Consideration for Pattern Generation,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol.21, no.5, pp.958-970, 2013, doi: 10.1109/TVLSI.2012.2197427.

    [J6] A. Todri, S. Kundu, P. Girard, A. Bosio, L. Dilillo, A. Virazel, “ A Study of Tapered 3D TSVs for Power and Thermal Integrity,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol.21, no.2, pp.306 - 319, 2013, doi: 10.1109/TVLSI.2012.2187081.

    [J5] G. Tsiligiannis, L. Dilillo, A. Bosio, P. Girard, A. Todri, A. Virazel, S. S. McClure, A. Touboul, F. Wrobel, F. Saigné, “Testing a Commercial MRAM under Neutron and Alpha Radiation in Dynamic Mode,” IEEE Transactions on Nuclear Science (TNS), vol.60, no.4, pp.2617-2622, 2013. doi: 10.1109/TNS.2013.2239311.

    [J4] A. Todri, M. Marek-Sadowska, “Reliability Analysis and Optimization for Power Gated ICs with Multiple Power Gating Configurations,” IEEE Transactions on Very Large Scale Integration Systems, vol.19, no.3, pp.457-468, 2011, doi: 10.1109/TVLSI.2009.2036267.

    [J3] A. Todri, M. Marek-Sadowska, “Power Delivery for Multi-Core Systems,” IEEE Transactions on Very Large Scale Integration Systems vol.19, no.12, pp.2243-2255, 2011, doi: 10.1109/TVLSI.2010.2080694.

    [J2] A. Todri, L. Perera, R. Rivera, and S. Kwan, “Reliability and Performance Studies of DC-DC Conversion Powering Scheme for the CMS Pixel Tracker at SLHC,” Journal of Instrumentation vol.5, C12010, 2010 doi: C12010.

    [J1] Andreani, A. Andreazza, A. Annovi, M. Beretta, V. Bevacqua, M. Bogdan, E. Bossini, A. Boveia, F. Canelli, Y. Cheng, M. Citterio, F. Crescioli, M. Dell'Orso, G. Drake, M. Dunford, J. F. Genat, P. Giannetti, F. Giorgi, J. Hoff, A. Kapliy, M. Kasten, Y. K. Kim, N. Kimura, A. Lanza, V. Liberali, T. Liu, A. McCarn, C. Melachrinos, C. Meroni, A. Negri, M. Neubauer, M. Piendibene, J. Proudfoot, G. Punzi, M. Riva, F. Sabatini, I. Sacco, L. Sartori, M. Shochet, A. Stabile, F. Tang, A. Todri, R. Tripiccione, J. Tuggle, V. Vercesi, M. Villa, R. A. Vitullo, G. Volpi, J. Wu, K. Yorita and J. Zhang, “Enhancement of the ATLAS Trigger System with a Hardware Tracker Finder FTK,” Institute of Physics Journal of Instrumentation, vol. 5, no. 12, C12037, 2010. doi: C12037 .