Call for Papers:

Software Product Line Engineering (SPLE) provides methods to promote systematic software reuse for developing a family of software products, rather than individual ones. It allows companies to produce a set of related products at lower costs, in a shorter time and with higher quality. SPLE focuses on efficiently producing and maintaining multiple similar software products, leveraging what they have in common and managing what varies among them. This is analogous to what is performed in the automotive industry, where the focus is on creating a single production line, which consists of a family of customized cars with common characteristics. In SPLE, products are developed from common and reusable software artefacts, called core assets. Core assets can be, but are not limited to, requirement documents, architecture, components, source code, test cases, etc. There are two essential tasks playing important roles for successful SPLE: variability management and product derivation.

The goal of the track VSPLE is to bring together researchers, industry R&D, engineers, practitioners and educators interested by all aspects related to software product line (SPL) and variability. The VSPLE track aims to be a forum to present and discuss recent ideas, trends, experiences, and challenges in this area.

Topics include but are not limited to:

• Variability management and modelling across the software life cycle

• Model driven, MDA and domain-specific languages for variable software and SPLs

• Variability related to requirements, domain analysis, business process, etc.

• Architecture and design of variable software and SPLs

• Variability of software designed based on services, aspects, views, components, ...

• Tests for variable software and SPLs

• Modeling, implementation and management of variability traceability

• Refactoring and evolution of variable software and SPLs

• Variability mining and reverse engineering

• Change impact analysis related to variable software and SPLs

• Dynamicity, adaptability, and reconfiguration aspects of variable software and SPLs

• Formal verification, reasoning and analysis techniques of variable software and SPLs

• Measurement of non-functional properties and performance of variable software and SPL

• Multi product lines and variability in systems of systems

• Open source software product line

• Empirical aspects related to variable software systems and SPLs

• Visualization and management of variability

• Usability of variable software systems and SPLs

• Application domains of SPLE and variability, e.g., mobile, e-services, web, ...

• Software economic and organizational aspects of variability and SPL engineering

Submissions:

Original papers addressing any of the listed topics of interest (or related topics) will be considered. Each submitted paper will be fully refereed and undergo a double-blind review process by at least three referees. Accepted papers will be included in the ACM SAC 2018 proceedings and published in the ACM digital library, being indexed by Thomson ISI Web of Knowledge and Scopus.

Paper size is limited to 8 pages. A maximum of 2 additional pages may be included for an additional fee (8+2). The reviews will be blind: authors’ names and affiliations must not appear in the paper and self-citations should be in the third person. Submitted papers must be formatted using the ACM SIG format (see the information in the bottom of this page).

Paper registration is required allowing the inclusion of the paper in the conference proceedings. An author or a proxy attending SAC must present the paper. This is a requirement for the paper to be included in the ACM digital library. No-show of scheduled papers and posters will result in excluding them from the ACM digital library.

Graduate students are invited to submit research abstracts (maximum 2 pages) to the Student Research Competition (SRC), following the instructions published at SAC 2018 website. Authors of selected abstracts will have the opportunity to give poster presentations of their work and compete for three top-winning places. The winners will receive cash awards and SIGAPP recognition certificates during the conference banquet. Authors of selected abstracts are eligible to apply to the SIGAPP Student Travel Award program for support.

Paper Submission:

 ** Regular Paper submission page

 ** Student Research Competition submission page

Templates 

Document templates (LaTex, MS Word) are available at http://www.acm.org/publications/proceedings-template.

Important Dates:

Paper Submission : Sep. 25, 2017 (Extended)

Author Notification : Nov. 10, 2017

Camera‐ready copies : Nov. 25, 2017

Track Chairs:

Abdelhak-Djamel Seriai, University of Montpellier, France :
seriai [at] lirmm [dot] fr

Tewfik Ziadi, University Pierre et Marie Curie, Paris, France :
tewfik.ziadi[at]lip6 [dot] fr

Program Committee:

• Mathieu Acher, Inria / University of Rennes I, France
• Ebrahim Bagheri, Ryerson University, Toronto, Canada
• Martin Becker, Fraunhofer IESE, Kaiserslautern, Germany
• Danilo Beuche, Pure Systems, Germany
• Mireille Blay‐Fornarino, University of Nice, France
• Jan Bosch, Chalmers University of Technology, Gothenburg, Sweden
• Goetz Botterweck, University of Limerick, Ireland
• Carlos Cetina, University San Jorge, Spain
• Maxime Cordy, University of Namur, Belgium
• Christophe Dony, LIRMM-CNRS/University of Montpellier, France
• Alessandro Fantechi, University of Florence, Italy
• Øystein Haugen, Østfold University College, Norway
• Marianne Huchard, University of Montpellier, France
• Kwanwoo Lee, Hansung University, South Korea
• Jaejoon Lee, Lancaster University, UK
• Malte Lochau, Darmstadt University of Technology, Germany
• Roberto E. Lopez-Herrejon, ETS/University of Quebec in Montreal, Canada
• Ivan C. Machado, Federal University of Bahia, Brazil
• Tomi Männistö, University of Helsinki, Finland
• Jabier Martinez, University Pierre et Marie Curie, France
• Toacy Oliveira, Federal University of Rio de Janeiro, Brazil
• Gilles Perrouin, University of Namur ASBL, Belgium
• Rick Rabiser, JOHANNES KEPLER UNIVERSITY LINZ, Austria
• Iris Reinhartz-Berger, University of Haifa, Israel
• Klaus Schmid, University of Hildesheim, Germany
• Thomas Thüm, Technical University of Braunschweig, Germany
• Bedir Tekinerdogan, Wageningen University, Netherlands
• Kentaro Yoshimura, Hitachi, Japan

Track Program:

TBD