Key dates:

Full paper: January 23 31, 2020

Notification: February 22, 2020

Camera Ready: March 27, 2020

Flash news (newest first):

- Special Issue deadline extended!

- Special Issue on Design, Technology,
and Test of Integrated Circuits and Systems.
Details here!!

- Technical program details are out!

- Social event preliminary information here!

- Camera-ready instruction details are out!

- Keynotes details are out!

- Venue information here

- Deadlines extended:
  Paper submission: January 31
  Special session proposal: January 31

- Registrations are open here!

- Submission website is active!

- Find out more on the special issue on
Microelectronics Reliability

- Call for special session is out! Check it out!

- Call for paper is out! Check it out!

Special Issue on Design, Technology, and Test of Integrated Circuits and Systems


Microelectronics Reliability seeks original manuscripts for a Special Issue on Design, Technology, and Test of Integrated Circuits and Systems scheduled to appear in an issue of 2021.

One of the main challenges for the electronic research field is to cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest of this Special Issue include the design, test and technology of electronic products, ranging from integrated circuit modules and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products. As a side effect of the device size shrinking, classical computing approaches are no more attractive and novel emerging paradigms technologies are progressively raising interests to the scientific community, which is actually working on: computing-in-memory architectures, approximate computing, evolvable computing, MEMRISTOR based devices and so on.

Topics of the Special Issue include, but are not limited to:

Submission Guideline:

Submitted articles must not have been previously published or currently submitted for journal publication elsewhere. It is mandatory for previous published work to add more than 30% of new material. As an author, you are responsible for understanding and adhering to our submission guidelines. You can access them at the Guide for Authors of Microelectronics Reliability. When submitting papers, please select the Article Type "VSI: DTIS_DDECS" in submission system. Please thoroughly read these before submitting your manuscript.

Important Dates:

Submission deadline: September 30th October 14th, 2020

Reviews completed: November 30th, 2020

First round notification: December 1st, 2020

Reviews of revisions: February 10th, 2021

Notification of final acceptance: February 15th, 2021

Publication materials for final manuscripts due: March 10th, 2021

Publication date: May 31st, 2021

Guest Editors

Luigi Dilillo
LIRMM – CNRS/University of Montpellier
161, rue Ada 34095 Montpellier, France
luigi.dilillo@lirmm.fr 

Zoran Stamenkovic
IHP - Leibniz-Institut für innovative Mikroelektronik,
Im Technologiepark 25,
15236 Frankfurt (Oder), Germany
stamenko@ihp-microelectronics.com

Alberto Bosio
Ecole Centrale de Lyon, 36 av. Guy de Collongue, F-69134 Ecully, France
alberto.bosio@ec-lyon.fr

Link to the Special Issue page