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Conference DTIP held by LIRMM in France

23rd edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS

This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in two main Conferences. Due to the sanitary crisis, DTIP will be online in 2021. We are working hard to offer the most imaginative and technically efficient solutions to allow all attendees to « meet » the DTIP community as usual…

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Katharina Boudgoust and network cryptography

Katharina Boudgoust’s work highlighted on our institute’s website: Katharina Boudgoust joined the LIRMM in 2023 as a member of the ECO team in the