23rd edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in two main Conferences. Due to the sanitary crisis, DTIP will be online in 2021. We are working hard to offer the most imaginative and technically efficient solutions to allow all attendees to « meet » the DTIP community as usual…
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Ahmed Chemori en Estonie : renforcer la coopération scientifique et promouvoir la robotique auprès des jeunes
La semaine dernière, Ahmed Chemori, chercheur CNRS au LIRMM, a été invité par l’Ambassade de France en Estonie à participer à plusieurs activités autour de la
28 octobre 2026
