23rd edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in two main Conferences. Due to the sanitary crisis, DTIP will be online in 2021. We are working hard to offer the most imaginative and technically efficient solutions to allow all attendees to « meet » the DTIP community as usual…
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Un bel article sur le projet Picopatt, la station climatique mobile
Le projet Picopatt étudie les variations climatiques à petite échelle en ville, ce que les chercheurs appellent les « pico-climats urbains ». L’objectif est de mieux guider
20 janvier 2025
