23rd edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in two main Conferences. Due to the sanitary crisis, DTIP will be online in 2021. We are working hard to offer the most imaginative and technically efficient solutions to allow all attendees to “meet” the DTIP community as usual…
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Félicitations aux étudiants de Polytech qui remportent la coupe NXP pour la deuxième année consécutive !
Les 10 et 11 mai derniers avait lieu à Bucarest la finale EMEA (Europe/Middle-East/Africa)de la coupe NXP, compétition étudiante autour du thème du véhicule autonome.
22 mai 2023
