23rd edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in two main Conferences. Due to the sanitary crisis, DTIP will be online in 2021. We are working hard to offer the most imaginative and technically efficient solutions to allow all attendees to « meet » the DTIP community as usual…
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Une belle collaboration entre le LIRMM, l’IES et le LMGC mise en valeur à la Fête de la science
Drônes marins. Bateaux autonomes à foil et à voile solaire rigide. Lors de la 33e édition de la Fête de la science, a été organisé
9 octobre 2024
