23rd edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in two main Conferences. Due to the sanitary crisis, DTIP will be online in 2021. We are working hard to offer the most imaginative and technically efficient solutions to allow all attendees to « meet » the DTIP community as usual…
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Le LIRMM renforce ses liens avec l’INP-HB de Côte d’Ivoire
Le 25 juin 2026, le LIRMM a accueilli une délégation de l’Institut National Polytechnique Félix Houphouët-Boigny (INP-HB) de Yamoussoukro (Côte d’Ivoire), composée des Professeurs Haba
1 juillet 2026
