Keywords: 3D integration, Carbon Nanotubes, Quantum computing, Adiabatic Logic, MRAM, MEMS/NEMS, CNT based biosensors, advanced analogue design, adaptive design solutions, statistical based design, low power design.

SmartIES investigates materials beyond silicon, which could help create the next generation of ICs. Carbon nanotubes are one-dimensional (1D) material and are among the contenders for energy efficient electronics. Other promising contenders are the two-dimensional (2D) materials (graphene, MoS2, etc.) as well as the vertical stacks of different two-dimensional materials known as Van Der Waals heterostructures.
Similarly, spintronics based memory is considered as a potential low power alternative to replace CMOS memory. In the quest of energy efficiency, SmartIES explorezs vertical integration such as three-dimensional (3D) stacking and monolithic 3D (M3D) integration to enable higher functionality, small form factor and heterogeneous implementation. Moreover, novel computing paradigms (adiabatic reversible logic, neuromorphic and quantum computing) are investigated to re-think how architectures and systems are designed to optimize power, performance and reliability.
But before, designing ICs with these emerging technologies necessitates the foundation of behavioral and realistic models for devices, interconnects and memory cells. Therefore, our research focuses on developing physics-driven electrical, thermal, reliability and statistical models to investigate various technology parameters such as process variation, temperature, noise, performance, power consumption and overall energy efficiency.
In recent years, we have researched on:

- Physics-driven modeling and simulation for devices and interconnects based on 1D and 2D materials for integrated circuits regarding power, performance, reliability, adaptability and scalability.
- Exploiting novel 1D/2D field-effect devices for biosensing applications.
- Physics-driven modeling and simulation for magnetic MRAM memories in integrated circuits and study their performance and reliability under temperature variations.
- Modeling and design of micro- and nano-electromechanical switches (MEMS/NEMS)
- Physical design and optimization techniques for energy efficient and reliable system design while considering process variations.
- Design space exploration of various integration schemes such as 3D stacking and monolithic 3D integration for large-scale energy efficient system design
- Exploring novel computing paradigms such as adiabatic reversible logic, neuromorphic computing and quantum computing.

Keywords: Data Fusion, Biosensors, Life and Environment Monitoring, Sensors for Physiological signal Communicating Systems, Bio Impedance Sensing, Signal Processing.

SmartIES develops sensors and/or associated conditioning electronics for specific or generic applications. Specific systems were developed for micro-system conditioning, bioelectric signal measurement (peripheral nervous system), intra-ocular pressure measurement (glaucoma diagnosis or prevention), bio-impedance spectroscopy (fat content, vitellogenesis in fish) and CNT-FET based biosensors (cancer-related enzymatic activity).
Moreover, generic interfaces for resistive or capacitive sensors are developed for conditioning and analog-to-digital signal conversion. They are in particular based on architectures or oscillators and are characterized as being compact, robust, adaptive, low-power and the nearest possible to the sensor.
SmartIES also designs connected multi-sensor systems. Main addressed applications are inertial navigation and marine species monitoring (tuna, marlin, turtles) both in terms of geolocation and physiological parameters measurements.
Last, the constant decreasing of the price of sensors enables heavy redundancy in system design. SmartIES develops data-fusion algorithms based on artificial neural networks, complementary filtering or dynamic weightening in order to improve resolution or robustness of these measurement systems.

Keywords: Side-Channel Attacks, Fault Injection, embedded cryptography, integrated countermeasures, IC integrity and authenticity, statistical and learning techniques, Signal Processing.

SmartIES aims at developing innovative solutions for designing and characterizing secure integrated circuits and systems against various attacks (side-channel and fault injection) aiming at denial of service or at extracting secret information. More precisely, smartIES has developed expertise related to the exploitation of electromagnetic (EM) waves and works at :

- Identifying unrevealed threats and new fault injection and side-channel attacks,
- Modeling the EM leakages and the impact of EM interference on ICs,
- Developing tools and platforms for an efficient characterization of ICs,
- Providing solutions to evaluate security during the design flow of ICs,
- Defining hardware countermeasures at the right cost,
- Developing solutions to detect hardware Trojans and counterfeits.

These activities are carried out through collaborative projects with industry, academics and government agencies or through direct partnerships. Technological transfers have been done towards some of our partners aiming notably at using our EM fault or Body Bias injection solutions; SmartIES being pioneer in this area.