SmartIES: Smart Integrated Electronic Systems

L’équipe SmartIES est une équipe d’une trentaine de chercheurs dont les activités sont centrées sur les méthodes de conception et la modélisation de dispositifs, systèmes et circuits intégrés conçus :

• en technologie CMOS,

• à l’aide de technologies émergentes (CNT, CNTFET, MRAM, …),

• selon des approches de conception alternatives (3D, adiabatique, …)

L’ensemble de ces travaux visent à développer des systèmes et circuits intégrés offrant de hautes performances et une consommation d’énergie réduite, mais également des circuits conscients d’eux même et de leur environnement et donc capables de s’adapter à celui-ci de sorte à garantir la fonctionnalité, la sureté de fonctionnement, la sécurité et le meilleur compromis performance consommation ou bien à satisfaire d’autres contraintes applicatives spécifiques. Dans cette démarche SmartIES se caractérise par sa volonté de conduire les approches théoriques jusqu’à des démonstrateurs expérimentaux ou des bancs de mesure. Au cours de la période, on peut noter de nombreux travaux ayant contribué à des réalisations matérielles (ASIC, plateformes expérimentales dédiées, prototypes matériels et/ou logiciels).

Activités Scientifiques

Depuis 1972, la microélectronique a été portée par l'évolution rapide de la technologie CMOS. Toutefois, depuis l’entrée en production de la technologie 90nm, cette évolution s'essouffle et nombreux sont ceux qui voient la technologie 7nm comme une barrière infranchissable. Des communiqués de presse annoncent la fin de la loi de Moore pour 2021. De son côté, l'ITRS2.0 voit l'avenir de l'électronique dans l'intégration 3D et le refroidissement des puces. Dans ce contexte, les activités de recherche de l'équipe SmartIES s'articulent autour de trois axes principaux :

  1. Conception de circuits et systèmes en technologies avancées ou émergentes
  2. Conception de circuits et systèmes communicants et conscients de leur environnement
  3. Sécurité matérielle : composants sécurisés et ondes électromagnétiques

Membres

Permanents

Non permanents

Publications depuis 2013 - Evaluation 2019

Articles de revues internationales

2018

  1. Effects of extraction method and storage of dry tissue on marine lipids and fatty acids
    Fany Sardenne, Nathalie Bodin, Luisa Métral, Anaïs Crottier, Fabienne Le Grand, Antoine Bideau, Blandine Brisset, Jérôme Bourjea, Claire Saraux, Sylvain Bonhommeau, Vincent Kerzérho, Serge Bernard, Tristan Rouyer
    Analytica Chimica Acta, Elsevier Masson, In press. <10.1016/j.aca.2018.11.012>
  2. System-level simulations of multi-sensor systems and data fusion algorithms
    Josué Manuel Rivera Velázquez, Frédérick Mailly, Pascal Nouet
    Microsystem Technologies, Springer Verlag, 2018. <10.1007/s00542-018-4204-8>
  3. A high-reliability and low-power computing-in-memory implementation within STT-MRAM
    Liuyang Zhang, Erya Deng, Hao Cai, You Wang, Lionel Torres, Aida Todri-Sanial, Youguang Zhang
    Microelectronics Journal, Elsevier, In press. <10.1016/j.mejo.2018.09.005>
  4. Power Supply Noise Aware Task Scheduling on Homogeneous 3D MPSoCs Considering the Thermal Constraint
    Ying-Lin Zhao, Jianlei Yang, Weisheng Zhao, Aida Todri-Sanial, Yuanqing Cheng
    Journal of Computer Science and Technology, Springer Verlag, 2018, 33 (5), pp.966-983.
  5. Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances - Part I: Pristine MWCNT
    Rongmei Chen, Jie Liang, Jaehyun Lee, Vihar P. Georgiev, Raphael Ramos, Hanako Okuno, Dipankar Kalita, Yuanqing Cheng, Liuyang Zhang, Reetu Raj Pandey, Salvatore Amoroso, Campbell Millar, Asenov Asen, Jean Dijon, Aida Todri-Sanial
    IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, In press. <10.1109/TED.2018.2868421>
  6. Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances - Part II: Impact of Charge Transfer Doping
    Rongmei Chen, Jie Liang, Jaehyun Lee, Vihar P. Georgiev, Raphael Ramos, Hanako Okuno, Dipankar Kalita, Yuanqing Cheng, Liuyang Zhang, Reeturaj Pandey, Salvatore Amoroso, Campbell Millar, Asenov Asen, Jean Dijon, Aida Todri-Sanial
    IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2018. <10.1109/TED.2018.2868424>
  7. Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study
    Jaehyun Lee, Salim Berrada, Fikru Adamu-Lema, Nicole Nagy, Vihar P. Georgiev, Toufik Sadi, Jie Liang, Raphael Ramos, Hamilton Carrillo-Nunez, Dipankar Kalita, Katharina Lilienthal, Marcus Wislicenus, Reeturaj Pandey, Bingan Chen, Kenneth B. K. Teo, Goncalo Goncalves, Hanako Okuno, Benjamin Uhlig, Aida Todri-Sanial, Jean Dijon, Asen Asenov
    IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2018, 65 (9), pp.3884-3892.
  8. A Temperature-Hardened Sensor Interface with a 12-Bit Digital Output Using a Novel Pulse Width Modulation Technique
    Emna Chabchoub, Franck Badets, Frédérick Mailly, Pascal Nouet, Mohamed Masmoudi
    Sensors, MDPI, 2018, 18 (4), pp.1107-1227.
  9. Addressing the Thermal Issues of STT-MRAM From Compact Modeling to Design Techniques
    Liuyang Zhang, Yuanqing Cheng, Kang Wang, Lionel Torres, Youguang Zhang, Aida Todri-Sanial
    IEEE Transactions on Nanotechnology, Institute of Electrical and Electronics Engineers, 2018, 17 (2), pp.345-352.
  10. On-chip Generation of Sine-wave Summing Digital Signals: an Analytic Study Considering Implementation Constraints
    Stéphane David-Grignot, Achraf Lamlih, Mohamed Moez Belhaj, Vincent Kerzérho, Florence Azaïs, Fabien Soulier, Philippe Freitas, Tristan Rouyer, Sylvain Bonhommeau, Serge Bernard
    Journal of Electronic Testing, Springer Verlag, 2018. <10.1007/s10836-018-5710-4>
  11. From theory to practice: horizontal attacks on protected implementations of modular exponentiations
    Ibrahima Diop, Yanis Linge, Thomas Ordas, Pierre-Yvan Liardet, Philippe Maurine
    Journal of Cryptographic Engineering, Springer, In press. <10.1007/s13389-018-0181-1>
  12. Estimating the Signal-to-Noise ratio under repeated sampling of the same centered signal: applications to side-channel attacks on a cryptoprocessor
    Gilles Ducharme, Philippe Maurine
    IEEE Transactions on Information Theory, Institute of Electrical and Electronics Engineers, In press. <10.1109/TIT.2018.2851217>
  13. Atomistic to Circuit-Level Modeling of Doped SWCNT for On-Chip Interconnects
    Jie Liang, Jaehyun Lee, Salim Berrada, Vihar Georgiev, Reetu Raj Pandey, Rongmei Chen, Asen Asenov, Aida Todri-Sanial
    IEEE Transactions on Nanotechnology, Institute of Electrical and Electronics Engineers, In press. <10.1109/TNANO.2018.2802320>

2017

  1. An On-Chip Technique to Detect Hardware Trojans and Assist Counterfeit Identification
    Maxime Lecomte, Jacques Jean-Alain Fournier, Philippe Maurine
    IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE, 2017, 25 (12), pp.3317-3330.
  2. Method for evaluation of transient-fault detection techniques
    Raphael Andreoni Camponogara-Viera, Rodrigo Possamai Bastos, Jean-Max Dutertre, Philippe Maurine, Rodrigo Iga Jadue
    Microelectronics Reliability, Elsevier, 2017, 76-77, pp.68-74.
  3. New Calibration Technique of Contact-less Resonant Biosensor
    Anthony Deluthault, Vincent Kerzérho, Serge Bernard, Fabien Soulier, Philippe Cauvet
    Journal of Electronic Testing, Springer Verlag, 2017, 33 (3), pp.365-375.
  4. Guest Editorial Special Issue on Nanoelectronic Circuit and System Design Methods for the Mobile Computing Era
    Aida Todri-Sanial, Saraju Mohanty, Mariane Comte, Marc Belleville
    ACM Journal on Emerging Technologies in Computing Systems, Association for Computing Machinery, 2017, 13 (2), pp.1-2.
  5. Efficient Objective Metric Tool for Medical Electrical Device Development: Eye Phantom for Glaucoma Diagnosis Device
    Anthony Deluthault, Luc Mezenge, Philippe Cauvet, Vincent Kerzérho, Fabien Soulier, Serge Bernard
    Journal of Sensors, Hindawi Publishing Corporation, 2017, 2017, pp.1687-725X.
  6. A fully-digital and ultra-low-power front-end for differential capacitive sensors
    Patcharee Kongpark, Souha Hacine, Laurent Latorre, Frédérick Mailly, Pascal Nouet
    Microsystem Technologies, Springer Verlag, 2017, 23 (9), pp.3991-4000.
  7. Smart-MEMS based inertial measurement units: gyro-free approach to improve the grade
    Gaurav Chatterjee, Laurent Latorre, Frédérick Mailly, Pascal Nouet, Nacim Hachelef, Coumar Oudea
    Microsystem Technologies, Springer Verlag, 2017, 23 (9), pp.3969-3978.
  8. A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits
    Aida Todri-Sanial, Raphael Ramos, Hanako Okuno, Jean Dijon, Abitha Dhavamani, Marcus Widlicenus, Katharina Lilienthal, Benjamin Uhlig, Toufik Sadi, Vihar Georgiev, Asen Asenov, Salvatore Amoroso, Andrew Pender, Andrew Brown, Campbell Millar, Fabian Motzfeld, Bernd Gotsmann, Jie Liang, Goncalo Goncalves, Nalin Rupesinghe, Ken Teo
    IEEE Circuits and Systems Magazine -New Series-, Institute of Electrical and Electronics Engineers, 2017, 17 (2), pp.47-62.
  9. Electromagnetic fault injection: the curse of flip-flops
    Sébastien Ordas, Ludovic Guillaume-Sage, Philippe Maurine
    Journal of Cryptographic Engineering, Springer, 2017, 7 (3), pp.183-197.

2016

  1. Temperature Impact Analysis and Access Reliability Enhancement for 1T1MTJ STT-RAM
    Bi Wu, Yuanqing Cheng, Jianlei Yang, Aida Todri-Sanial, Weisheng Zhao
    IEEE Transactions on Reliability, Institute of Electrical and Electronics Engineers, 2016, 65 (4), pp.1755-1768.
  2. A Study of 3-D Power Delivery Networks With Multiple Clock Domains
    Aida Todri-Sanial, Yuanqing Cheng
    IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE, 2016, 24 (11), pp.3218-3231.
  3. Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect
    Yuanqing Cheng, Aida Todri-Sanial, Jianlei Yang, Weisheng Zhao
    IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE, 2016, 24 (11), pp.3310-3322.
  4. Mutual information analysis: higher-order statistical moments, efficiency and efficacy
    Mathieu Carbone, Yannick Teglia, Gilles R. Ducharme, Philippe Maurine
    Journal of Cryptographic Engineering, Springer, 2016, Journal of Cryptographic Engineering, 5 (20). <10.1007/s13389-016-0123-8>
  5. Energy Study for 28 nm Fully Depleted Silicon-On-Insulator Devices
    Rida Kheirallah, Gilles Ducharme, Nadine Azemard
    Journal of Low Power Electronics, American Scientific Publishers, 2016, 12 (1), pp.58-63.
  6. SSB Phase Noise Evaluation of Analog/IF Signals on Standard Digital ATE
    Florence Azaïs, Stéphane David-Grignot, Laurent Latorre, François Lefevre
    Journal of Electronic Testing, Springer Verlag, 2016, 32 (1), pp.69-82.
  7. Electrothermal Analysis of Carbon Nanotubes Power Delivery Networks for Nanoscale Integrated Circuits
    Alessandro Magnani, Massimiliano De Magistris, Aida Todri-Sanial, Antonio Maffucci
    IEEE Transactions on Nanotechnology, Institute of Electrical and Electronics Engineers, 2016, 15 (3), pp.380-388.
  8. Digital Embedded Test Instrument for On-Chip Phase Noise Testing of Analog/RF Integrated Circuits
    Florence Azaïs, Stéphane David-Grignot, Laurent Latorre, François Lefevre
    Journal of Circuits, Systems, and Computers, World Scientific Publishing, 2016. <10.1142/S0218126616400144>
  9. A phantom axon setup for validating models of action potential recordings
    Olivier Rossel, Fabien Soulier, Serge Bernard, David Guiraud, Guy Cathébras
    Medical and Biological Engineering and Computing, Springer Verlag, 2016, 10 (4), pp.671-678.

2015

  1. Efficiency evaluation of analog/RF alternate test: Comparative study of indirect measurement selection strategies
    Syhem Larguech, Florence Azaïs, Serge Bernard, Mariane Comte, Vincent Kerzérho, Michel Renovell
    Microelectronics Journal, Elsevier, 2015, 46 (11), pp.1091-1102.
  2. A new monolithic 3-axis thermal convective accelerometer: principle, design, fabrication and characterization
    Huy Binh Nguyen, Frédérick Mailly, Laurent Latorre, Pascal Nouet
    Microsystem Technologies, Springer Verlag, 2015, 21 (9), pp.1867-1877.
  3. Pressure sensing method based on the transient response of a thermally actuated micro-wire
    Olivier Legendre, Hervé Bertin, Hervé Mathias, Ming Zhang, Souhil Megherbi, Frédérick Mailly
    Sensors and Actuators A: Physical , Elsevier, 2015, 221, pp.115-122.
  4. Phase Noise Testing of Analog/IF Signals Using Digital ATE: A New Post-Processing Algorithm for Extended Measurement Range
    Stéphane David-Grignot, Florence Azaïs, Laurent Latorre, François Lefevre
    Journal of Electronic Testing, Springer Verlag, 2015, pp.1-17.
  5. Special Issue on Advances in Design of Ultra-Low Power Circuits and Systems in Emerging Technologies
    Aida Todri-Sanial, Sanjukta Bhanja
    ACM Journal on Emerging Technologies in Computing Systems, Association for Computing Machinery, 2015, Guest Editorial, 12 (2), pp.#11.
  6. Vertical and horizontal correlation attacks on RNS-based exponentiations
    Guilherme Perin, Laurent Imbert, Philippe Maurine, Lionel Torres
    Journal of Cryptographic Engineering, Springer, 2015, 5 (3), pp.171-185.

2014

  1. A model of the leakage in the frequency domain and its application to CPA and DPA
    Sébastien Tiran, Sébastien Ordas, Yannick Teglia, Michel Agoyan, Philippe Maurine
    Journal of Cryptographic Engineering, Springer, 2014, 4 (3), pp.197-212.
  2. Evaluating a Radiation Monitor for Mixed-Field Environments based on SRAM Technology
    Georgios Tsiligiannis, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Aida Todri-Sanial, Arnaud Virazel, Julien Mekki, Markus Brugger, Frédéric Wrobel, Frédéric Saigné
    Journal of Instrumentation, IOP Publishing, 2014, 9. <10.1088/1748-0221/9/05/C05052>
  3. Multiple Cell Upset Classification in Commercial SRAMs
    Georgios Tsiligiannis, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Aida Todri-Sanial, Arnaud Virazel, Helmut Puchner, Christopher Frost, Frédéric Wrobel, Frédéric Saigné
    IEEE Transactions on Nuclear Science, Institute of Electrical and Electronics Engineers, 2014, 61 (4), pp.1747-1754.
  4. Enhancing Confidence in Indirect Analog/RF Testing against the Lack of Correlation between Regular Parameters and Indirect Measurements
    Haithem Ayari, Florence Azaïs, Serge Bernard, Mariane Comte, Vincent Kerzérho, Michel Renovell
    Microelectronics Journal, Elsevier, 2014, 45 (3), pp.336-344.
  5. An SRAM Based Monitor for Mixed-Field Radiation Environments
    Georgios Tsiligiannis, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Aida Todri-Sanial, Arnaud Virazel, Julien Mekki, Markus Brugger, Frédéric Wrobel, Frédéric Saigné
    IEEE Transactions on Nuclear Science, Institute of Electrical and Electronics Engineers, 2014, 61 (4), pp.1663-1670.
  6. Study of Low-Cost Electrical Test Strategies for Post-Silicon Yield Improvement of MEMS Convective Accelerometers
    Ahmed Rekik, Florence Azaïs, Frédérick Mailly, Pascal Nouet
    Journal of Electronic Testing, Springer Verlag, 2014, 30 (1), pp.87-100.
  7. A Complete Resistive-Open Defect Analysis for Thermally Assisted Switching MRAMs
    João Azevedo, Arnaud Virazel, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Jérémy Alvarez-Hérault, Ken Mackay
    IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE, 2014, 22 (11), pp.2326-2335.
  8. Globally Constrained Locally Optimized 3-D Power Delivery Networks
    Aida Todri-Sanial, Sandip Kundu, Patrick Girard, Alberto Bosio, Luigi Dilillo, Arnaud Virazel
    IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE, 2014, 22 (10), pp.2131-2144.
  9. Dynamic Variability Monitoring Using Statistical Tests for Energy Efficient Adaptive Architectures
    Lionel Vincent, Edith Beigné, Suzanne Lesecq, Julien Mottin, David Coriat, Philippe Maurine
    IEEE Transactions on Circuits and Systems Part 1 Fundamental Theory and Applications, Institute of Electrical and Electronics Engineers (IEEE), 2014, Part I: Regular Papers, 61 (6), pp.1741-1754.

2013

  1. Sensitivity and power modeling of CMOS mems single axis convective accelerometers
    Brahim Mezghani, Fares Tounsi, Ahmed Rekik, Frédérick Mailly, Mohamed Masmoudi, Pascal Nouet
    Microelectronics Journal, Elsevier, 2013, 44 (12), pp.1092-1098.
  2. A novel implementation of the histogram-based technique for measurement of INL of LUT-based correction of ADC
    Vincent Kerzérho, Serge Bernard, Florence Azaïs, Mariane Comte, Olivier Potin, Chuan Shan, Guilherme Bontorin, Michel Renovell
    Microelectronics Journal, Elsevier, 2013, 44 (9), pp.840-843.
  3. Uncorrelated Power Supply Noise and Ground Bounce Consideration for Test Pattern Generation
    Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel
    IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE, 2013, 21 (5), pp.958-970.
  4. Novel humidity sensing method based on the transient response of a micro-heater
    Olivier Legendre, Hervé Bertin, Hervé Mathias, Frédérick Mailly, Souhil Megherbi
    Sensors and Actuators A: Physical , Elsevier, 2013, 192, pp.92-100.
  5. Testing a Commercial MRAM under Neutron and Alpha Radiation in Dynamic Mode
    Georgios Tsiligiannis, Luigi Dilillo, Alberto Bosio, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Steven Mcclure, Antoine Touboul, Frédéric Wrobel, Frédéric Saigné
    IEEE Transactions on Nuclear Science, Institute of Electrical and Electronics Engineers, 2013, 60 (4), pp.2617-2622.
  6. A Study of Tapered 3-D TSVs for Power and Thermal Integrity
    Aida Todri-Sanial, Sandip Kundu, Patrick Girard, Alberto Bosio, Luigi Dilillo, Arnaud Virazel
    IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE, 2013, 21 (2), pp.306-319.

Communications internationales

2018

  1. Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation
    Abhishek Koneru, Aida Todri-Sanial, Krishnendu Chakrabarty
    ICECS: International Conference on Electronics Circuits and Systems, Dec 2018, Bordeaux, France. 25th IEEE International Conference on Electronics Circuits and Systems, 2018. <https://www.ieee-icecs2018.org>
  2. A multitone analysis for bioimpedance spectroscopy using minimal digital ressource
    Fabien Soulier, Achraf Lamlih, Vincent Kerzérho, Serge Bernard
    ICST: International Conference on Sensing Technology, Dec 2018, Limerick, Ireland. 12th International Conference on Sensing Technology, 2018. <http://www.ece.ul.ie/icst2018>
  3. Electromagnetic Activity vs. Logical Activity: Near Field Scans for Reverse Engineering
    Marc Lacruche, Philippe Maurine
    CARDIS: Smart Card Research and Advanced Applications, Nov 2018, Montpellier, France. 17th Smart Card Research and Advanced Application Conference, 2018. <https://cardis2018.sciencesconf.org>
  4. The impact of pulsed electromagnetic fault injection on true random number generators
    Maxime Madau, Michel Agoyan, Josep Balash, Milos Grujic, Patrick Haddad, Philippe Maurine, Vladimir Rozic, Dave Singelee, Bohan Yang, Ingrid Verbauwhede
    J. Daemen; L. Sauvage. FDTC: Fault Diagnosis and Tolerance in Cryptography, Sep 2018, Amsterdam, Netherlands. IEEE International Workshop on Fault Diagnosis and Tolerance in Cryptography, 2018. <10.5281/zenodo.1434075>
  5. Exploiting Phase Information in Thermal Scans for Stealthy Trojan Detection
    Maxime Cozzi, Jean-Marc Galliere, Philippe Maurine
    DSD: Digital System Design, Aug 2018, Prague, Slovakia. Euromicro Conference on Digital System Design, 2018. <http://dsd-seaa2018.fit.cvut.cz/dsd/>
  6. A Robust Dual Reference Computing-in-Memory Implementation and Design Space Exploration Within STT-MRAM
    Liuyang Zhang, Wang Kang, Hao Cai, Peng Ouyang, Lionel Torres, Youguang Zhang, Aida Todri-Sanial, Weisheng Zhao
    ISVLSI: International Symposium on Very Large Scale Integration, Jul 2018, Hong Kong, China. IEEE Computer Society Annual Symposium on VLSI, 2018. <10.1109/ISVLSI.2018.00058>
  7. Combined analysis of supply voltage and body-bias voltage for energy management
    Rida Kheirallah, Jean-Marc Galliere, Nadine Azemard, Gilles Ducharme
    PATMOS: Power and Timing Modeling, Optimization and Simulation, Jul 2018, Platja d’Aro, Spain. 28th IEEE International Symposium on Power and Timing Modeling, Optimization and Simulation, 2018. <10.1109/PATMOS.2018.8464159>
  8. Chameleon: A Thermally Adaptive Error Correction Code Design for STT-MRAM LLCs
    Dijun Liu, Yuanqing Cheng, Y. Wang, B. Wu, B. Zhang, Aida Todri-Sanial, Weisheng Zhao
    DAC: Design Automation Conference, Jun 2018, San Fransisco, United States. 2018.
  9. Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects
    Benjamin Uhlig, Abitha Dhavamani, Nicole Nagy, Katharina Lilienthal, Liske R., Raphael Ramos, Jean Dijon, Hanako Okuno, Dipankar Kalita, Lee Jaehyun, Vihar P. Georgiev, Asenov Asen, Salvatore Amoroso, Liping Wang, Koenemann Fabien, Bernd Gotsmann, Goncalo Goncalves, Bingam Cheng, Jie Liang, Reetu Raj Pandey, Rongmei Chen, Aida Todri-Sanial
    IITC: International Interconnect Technology Conference, Jun 2018, Santa Clara, United States. 21st IEEE International Interconnect Technology Conference, pp.16-18, 2018.
  10. Wideband Fully Differential Current Driver with Optimized Output Impedance for Bioimpedance Measurements
    Achraf Lamlih, Philippe Freitas, Stephane David-Grignot, Jérémie Salles, Vincent Kerzérho, Fabien Soulier, Serge Bernard, Tristan Rouyer, Sylvain Bonhommeau
    ISCAS: International Symposium on Circuits and Systems, May 2018, Florence, Italy. IEEE, IEEE International Symposium on Circuits and Systems, 2018. <10.1109/ISCAS.2018.8351464>
  11. Post-fabrication soft trimming of resistive sensors
    Ibrahim Shankhour, Jad Mohdad, Frédérick Mailly, Pascal Nouet
    DTIP: Design, Test, Integration and Packaging, May 2018, Roma, Italy. IEEE, 20th Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS, 2018. <10.1109/DTIP.2018.8394221>
  12. A generic model for sensor simulation at system level
    Pascal Nouet, Josue Manuel Rivera Velazquez, Frédérick Mailly
    DTIP: Design, Test, Integration and Packaging, May 2018, Roma, Italy. IEEE, 20th Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS, 2018. <10.1109/DTIP.2018.8394198>
  13. Thermal Scans for Detecting Hardware Trojans
    Maxime Cozzi, Philippe Maurine, Jean-Marc Galliere
    COSADE: Constructive Side-Channel Analysis and Secure Design, Apr 2018, Singapour, Singapore. 9th International Workshop on Constructive Side-Channel Analysis and Secure Design, LNCS (10815), pp.117-132, 2018, COSADE 2018.
  14. Standard CAD Tool-Based Method for Simulation of Laser-Induced Faults in Large-Scale Circuits
    Raphael Andreoni Camponogara-Viera, Jean-Max Dutertre, Philippe Maurine, Rodrigo Possamai Bastos
    ISPD: International Symposium on Physical Design, Mar 2018, Monterey, CA, United States. ACM Press, International Symposium on Physical Design, pp.160-167, 2018.
  15. Using multifunctional standardized stack as universal spintronic technology for IoT
    Mehdi B. Tahoori, Sarath Mohanachandran Nair, Rajendra Bishnoi, Sophiane Senni, Jad Mohdad, Frédérick Mailly, Lionel Torres, Pascal Benoit, Abdoulaye Gamatié, Pascal Nouet, Frédéric Ouattara, Gilles Sassatelli, Kotb Jabeur, Pierre Vanhauwaert, Alexandru Atitoaie, Ioana Firastrau, G. Di Pendina, Guillaune Prenat
    DATE: Design, Automation and Test in Europe, Mar 2018, Dresden, Germany. IEEE Design, Automation & Test in Europe Conference & Exhibition, 2018. <10.23919/DATE.2018.8342143>
  16. Progress on carbon nanotube BEOL interconnects
    Benjamin Uhlig, Jie Liang, Lee Jaehyun, Raphael Ramos, Abitha Dhavamani, Nicole Nagy, Jean Dijon, Hanako Okuno, Dipankar Kalita, Vihar P. Georgiev, Asenov Asen, Salvatore Amoroso, Liping Wang, Campbell Millar, F. Konemann, Bernd Gotsmann, Goncalo Goncalves, Bingham Chen, Reetu Raj Pandey, Rongmei Chen, Aida Todri-Sanial
    DATE: Design, Automation and Test in Europe, Mar 2018, Dresden, Germany. 21st Design, Automation & Test in Europe Conference & Exhibition, 2018. <10.23919/DATE.2018.8342144>

2017

  1. A physics-based investigation of Pt-salt doped carbon nanotubes for local interconnects
    Jie Liang, Raphael Ramos, Jean Dijon, H. Okuno, D. Kalita, D. Renaud, J. Lee, Vihar Georgiev, Salim Berrada, T. Sadi, A. Asenov, B. Uhlig, K. Lilienthal, A. Dhavamani, F. Konemann, B. Gotsmann, G. Goncalves, B. Chen, K. Teo, Reetu Pandey, Aida Todri-Sanial
    IEDM: International Electron Devices Meeting, Dec 2017, San Francisco, United States. IEEE, IEEE International Electron Devices Meeting, 2018. <10.1109/IEDM.2017.8268502>
  2. Synchronised 4-Phase Resonant Power Clock Supply for Energy Efficient Adiabatic Logic
    Nicolas Jeanniot, Gael Pillonnet, Pascal Nouet, Nadine Azemard, Aida Todri-Sanial
    ICRC: International Conference on Rebooting Computing, Nov 2017, Washington, DC, United States. IEEE, IEEE International Conference on Rebooting Computing, 2017. <10.1109/ICRC.2017.8123661>
  3. Atomistic to circuit level modeling of defective doped SWCNTs with contacts for on-chip interconnect application
    Jie Liang, Lee Jaehyun, Salim Berrada, Vihar P. Georgiev, Asenov Asen, Nadine Azemard, Aida Todri-Sanial
    NMDC: Nanotechnology Materials and Devices Conference, Oct 2017, Singapore, Singapore. IEEE 12th Nanotechnology Materials and Devices Conference, 2017. <10.1109/NMDC.2017.8350506>
  4. Method for evaluation of transient-fault detection techniques
    Raphael Andreoni Camponogara-Viera, Rodrigo Possamai Bastos, Jean-Max Dutertre, Philippe Maurine
    ESREF: European Symposium on Reliability of Electron devices, Failure physics and analysis, Sep 2017, Bordeaux, France. 2017.
  5. Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology
    Jaehyun Lee, Jie Liang, Salvatore Amoroso, Toufik Sadi, Liping Wang, Asen Asenov, Andrew Pender, Dave Reid, Vihar Georgiev, Campbell Millar, Aida Todri-Sanial
    SISPAD: Simulation of Semiconductor Processes and Devices, Sep 2017, Kamakura, Japan. IEEE, International Conference on Simulation of Semiconductor Processes and Devices, 2017. <10.23919/SISPAD.2017.8085287>
  6. The impact of vacancy defects on CNT interconnects: From statistical atomistic study to circuit simulations
    Jaehyun Lee, Salim Berrada, Jie Liang, Toufik Sadi, Vihar Georgiev, Aida Todri-Sanial, Dipankar Kalita, Raphaël Ramos, Hanako Okuno, Jean Dijon, Asen Asenov
    SISPAD: International Conference on Simulation of Semiconductor Processes and Devices, Sep 2017, Kamakura, Japan. IEEE, International Conference on Simulation of Semiconductor Processes and Devices, 2017. <10.23919/SISPAD.2017.8085288>
  7. Role of Laser-Induced IR Drops in the Occurrence of Faults: Assessment and Simulation
    Raphael Andreoni Camponogara-Viera, Jean-Max Dutertre, Rodrigo Possamai Bastos, Philippe Maurine
    DSD: Digital System Design, Aug 2017, Vienna, Austria. IEEE, Euromicro Conference on Digital System Design, 2017. <10.1109/DSD.2017.43>
  8. High Temperature, Time Domain Sensor Interface based on Phase Shifter
    Emna Chabchoub, Franck Badets, Mohamed Masmoudi, Pascal Nouet, Frédérick Mailly
    HiTen: High Temperature Electronics Network, Jul 2017, Cambridge, United Kingdom. International Conference and Exhibition on High Temperature Electronics Network, 2017 (HiTen), pp.103-108, 2017.
  9. GREAT: HeteroGeneous IntegRated Magnetic tEchnology Using Multifunctional Standardized sTack
    Mehdi B. Tahoori, Sarath Mohanachandran Nair, Rajendra Bishnoi, Sophiane Senni, Jad Mohdad, Frédérick Mailly, Lionel Torres, Pascal Benoit, Pascal Nouet, Rui Ma, Martin Kreißig, Frank Ellinger, Kotb Jabeur, Pierre Vanhauwaert, Gregory Di Pendina, Guillaune Prenat
    ISVLSI: International Symposium on Very Large Scale Integration, Jul 2017, Bochum, Germany. IEEE International Symposium on Very Large Scale Integration, 2017. <10.1109/ISVLSI.2017.67>
  10. Analytical Study of On-chip Generations of Analog Sine-wave Based on Combined Digital Signals
    Stéphane David-Grignot, Achraf Lamlih, Vincent Kerzérho, Florence Azaïs, Fabien Soulier, Serge Bernard
    IMSTW: International Mixed Signals Testing Workshop, Jul 2017, Thessaloniki, Greece. IEEE, 22nd IEEE International Mixed Signals Testing Workshop, 2017. <10.1109/IMS3TW.2017.7995205>
  11. New time-domain conditioning circuit for resistive sensor: Behavioral modelling for simulation and optimization
    Emna Chabchoub, Franck Badets, Mohamed Masmoudi, Frédérick Mailly, Pascal Nouet
    MIXDES: Mixed Design of Integrated Circuits and Systems, Jun 2017, Bydgoszcz, Poland. IEEE, 24th International Conference on Mixed Design of Integrated Circuits and Systems, pp.408-411, 2017.
  12. Importance of IR Drops on the Modeling of Laser-Induced Transient Faults
    Raphael Andreoni Camponogara-Viera, Philippe Maurine, Jean-Max Dutertre, Rodrigo Possamai Bastos
    SMACD: Synthesis, Modeling, Analysis and simulation methods and applications to Circuit Design, Jun 2017, Giardini Naxos, Taormina, Italy. IEEE, 14th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design, 2017. <10.1109/SMACD.2017.7981593>
  13. A hierarchical model for CNT and Cu-CNT composite interconnects: from density functional theory to circuit-level simulations
    Lee Jaehyun, Sadi Toufik, Jie Liang, Vihar Georgiev, Aida Todri-Sanial, Asenov Asen
    IWCN: International Workshop on Computational Nanotechnology, Jun 2017, Windermere, United Kingdom. 19th IEEE International Workshop on Computational Nanotechnology, 2017. <http://iwcn2017.iopconfs.org/>
  14. Toward Carbon Nanotube Computing
    Aida Todri-Sanial
    Emerging Technology, May 2017, Varsovie, Poland. CMOS Emerging Technology Research Symposium, 2017. <http://www.etcmos.com/current_event.php?event=2017>
  15. A high temperature, 12-bit-time-domain sensor interface based on injection locked oscillator
    Emna Chabchoub, Franck Badets, Pascal Nouet, Mohamed Masmoudi, Frédérick Mailly
    ISCAS: International Symposium on Circuits and Systems, May 2017, Baltimore, United States. IEEE, 50th IEEE International Symposium of Circuits and Systems., pp.1-4, 2017.
  16. Formal analysis of high-performance stabilized active-input current mirror
    Mohan Julien, Serge Bernard, Fabien Soulier, Vincent Kerzérho, Guy Cathébras
    ISCAS: International Symposium on Circuits and Systems, May 2017, Baltimore, MD, United States. IEEE, IEEE International Symposium on Circuits and Systems, 2017. <10.1109/ISCAS.2017.8051012>
  17. Electrical performance of carbon-based power distribution networks with thermal effects
    A. Magnani, M. De Magistris, S. Heidari, Aida Todri-Sanial, A. Maffucci
    SPI: Signal and Power Integrity, May 2017, Baveno, Italy. IEEE, IEEE 21st Workshop on Signal and Power Integrity, 2017. <10.1109/SaPIW.2017.7944044>
  18. Combo of innovative educational approaches to teach industrial test to undergraduate students
    Beatrice Pradarelli, Pascal Nouet, Laurent Latorre
    EDUCON: Global Engineering Education Conference, Apr 2017, Athens, Greece. IEEE, 8th IEEE Global Engineering Education Conference, 2017. <10.1109/EDUCON.2017.7942824>
  19. Impacts of Technology Trends on Physical Attacks?
    Philippe Maurine, Sylvain Guilley
    COSADE: Constructive Side-Channel Analysis and Secure Design, Apr 2017, Paris, France. International Workshop on Constructive Side-Channel Analysis and Secure Design, LNCS (10348), pp.190-206, 2017.
  20. Formal analysis of bandwidth enhancement for high-performance active-input current mirror
    Mohan Julien, Serge Bernard, Fabien Soulier, Vincent Kerzérho, Guy Cathébras
    DTIS: Design and Technology of Integrated Systems in Nanoscale Era, Apr 2017, Palma de Mallorca, Spain. IEEE, 12th International Conference on Design & Technology of Integrated Systems In Nanoscale Era, 2017. <10.1109/DTIS.2017.7930162>
  21. Highly linear voltage-to-time converter based on injection locked relaxation oscillators
    Emna Chabchoub, Franck Badets, Mohamed Masmoudi, Pascal Nouet, Frédérick Mailly
    SSD: Systems, Signals and Devices, Mar 2017, Marrakech, Morocco. IEEE, 14th International Multi-Conference on Systems, Signals and Devices, 2017, SAC: Systems, Analysis and Automatic. <10.1109/SSD.2017.8167011>
  22. Power and Performance Analysis of Doped SW/DW CNT for On-Chip Interconnect Application
    Aida Todri-Sanial, Jie Liang
    GRAPHENE, Mar 2017, Barcelone, Spain. 7th edition of the largest European Conference in Graphene and 2D Materials, 2017. <http://www.grapheneconf.com/2017/>

2016

  1. EKF-based state estimation for train localization
    Damien Veillard, Frédérick Mailly, Philippe Fraisse
    IEEE Sensors 2016 , Oct 2016, Orlando, United States. 2016, Proceedings of IEEE Sensors 2016 Conference. <10.1109/ICSENS.2016.7808726>
  2. Mixed-level simulation tool for design optimization of electrical impedance spectroscopy systems
    Achraf Lamlih, Vincent Kerzérho, Serge Bernard, Fabien Soulier, Mariane Comte, Michel Renovell, Tristan Rouyer, Sylvain Bonhommeau
    IWIS: International Workshop on Impedance Spectroscopy, Sep 2016, Chemnitz, Germany. Session: Bioimpedance Spectroscopy II (N012). <https://www.tu-chemnitz.de/etit/messtech/iwis/openconf/modules/request.php?module=oc_program&action=program.php>
  3. Investigation of electrical and thermal properties of carbon nanotube interconnects
    Aida Todri-Sanial
    PATMOS: Power and Timing Modeling, Optimization and Simulation, Sep 2016, Brême, Zimbabwe. IEEE, 26th International Workshop on Power and Timing Modeling, Optimization and Simulation, pp.25-32, 2016.
  4. Electrothermal Modeling and Analysis of Carbon Nanotube Interconnects
    Aida Todri-Sanial
    PATMOS: Power And Timing Modeling, Optimization and Simulation, Sep 2016, Brême, Germany. 26th International Workshop on Power And Timing Modeling, Optimization and Simulation, 2016. <http://www.item.uni-bremen.de/patmos/>
  5. Problem-Based Learning Approach to Teach Printed Circuit Boards Test
    Beatrice Pradarelli, Pascal Nouet, Laurent Latorre
    ICL: Interactive Collaborative Learning, Sep 2016, Belfast, United Kingdom. 19th International Conference on Interactive Collaborative Learning, 2016. <http://www.icl-conference.org/icl2016/>
  6. Physical description and analysis of doped carbon nanotube interconnects
    Jie Liang, Liuyang Zhang, Nadine Azemard, Pascal Nouet, Aida Todri-Sanial
    PATMOS: Power and Timing Modeling, Optimization and Simulation, Sep 2016, Brême, Germany. IEEE, 26th IEEE International Workshop on Power and Timing Modeling, Optimization and Simulation, pp.250-255, 2016.
  7. Modeling and Simulation of Carbon Nanotube Interconnects
    Aida Todri-Sanial
    SISPAD: Simulation of Semiconductor Processes and Devices, Sep 2016, Nuremberg, Germany. 21st International Conference on Simulation of Semiconductor Processes and Devices, 2016. <http://www.sispad2016.org>
  8. A Simple Conditioner for Resonant Intraocular Pressure Sensor
    Fabien Soulier, Frédérick Mailly, Vincent Kerzérho, Anthony Deluthault, Serge Bernard, Philippe Cauvet
    EUROSENSORS XXX, Sep 2016, Budapest, Hungary. 30th European Conference on Solid-State Transducers, 168, pp.67-70, 2016, Procedia Engineering.
  9. An Embedded Digital Sensor against EM and BB Fault Injection
    David El-Baze, Jean-Baptiste Rigaud, Philippe Maurine
    FDTC: Fault Diagnosis and Tolerance in Cryptography, Aug 2016, Santa Barbara, CA, United States. IEEE, Workshop on Fault Diagnosis and Tolerance in Cryptography, pp.78-86, 2016.
  10. Efficient calibration of contact-less resonant bio-sensor affected by operating conditions
    Anthony Deluthault, Vincent Kerzérho, Serge Bernard, Fabien Soulier, Philippe Cauvet
    IMSTW: International Mixed-Signal Testing Workshop, Jul 2016, Sant Feliu de Guixols, Spain. 21st IEEE International Mixed-Signal Testing Workshop, pp.1-6, 2016.
  11. Quantitative evaluation of reliability and performance for STT-MRAM
    Liuyang Zhang, Aida Todri-Sanial, Wang Kang, Youguang Zhang, Lionel Torres, Yuanqing Cheng, Weisheng Zhao
    ISCAS: International Symposium on Circuits and Systems, May 2016, Montréal, QC, Canada. IEEE, http://iscas2016.org, pp.1150-1153, 2016.
  12. Per Peers Learning Education Approach to Teach Industrial Test to Undergraduate Students
    Beatrice Pradarelli, Pascal Nouet, Laurent Latorre
    EWME: European Workshop on Microelectronics Education, May 2016, Southampton, United Kingdom. 11th European Workshop on Microelectronics Education, 2016. <http://ewme2016.ecs.soton.ac.uk>
  13. Investigation of the power-clock network impact on adiabatic logic
    Nicolas Jeanniot, Aida Todri-Sanial, Pascal Nouet, Gaël Pillonnet, Hervé Fanet
    SPI: Signal and Power Integrity, May 2016, Turin, Italy. 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) pp.1-4, 2016.
  14. A clustering technique for fast electrothermal analysis of on-chip power distribution networks
    Alessandro Magnani, Massimiliano De Magistris, Antonio Maffucci, Aida Todri-Sanial
    SPI: Signal and Power Integrity, May 2016, Turin, Italy. IEEE, IEEE 20th Workshop on Signal and Power Integrity, pp.1-4, 2016.
  15. Granularity and detection capability of an adaptive embedded Hardware Trojan detection system
    Maxime Lecomte, Jacques Jean-Alain Fournier, Philippe Maurine
    HOST: Hardware Oriented Security and Trust, May 2016, McLean, VA, United States. IEEE, IEEE International Symposium on Hardware Oriented Security and Trust, pp.135-138, 2016.
  16. Reliability and performance evaluation for STT-MRAM under temperature variation
    Liuyang Zhang, Yuanqing Cheng, Wang Kang, Youguang Zhang, Lionel Torres, Weisheng Zhao, Aida Todri-Sanial
    EuroSimE: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2016, Montpellier, France. 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, pp.1-4, 2016.
  17. Present and future prospects of carbon nanotube interconnects for energy efficient integrated circuits
    Aida Todri-Sanial, Alessandro Magnani, Massimiliano De Magistris, Antonio Maffucci
    EuroSimE: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2016, Montpellier, France. 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2016. <10.1109/EuroSimE.2016.7463379>
  18. Industrial Test Project Oriented Education
    Beatrice Pradarelli, Pascal Nouet, Laurent Latorre
    EDUCON: Global Engineering Education Conference, Apr 2016, Abu Dhabi, United Arab Emirates. IEEE, 2016. <http://www.educon-conference.org/educon2016/index.php>
  19. A Fully-Digital Em Pulse Detector
    El-Baze David, Jean-Baptiste Rigaud, Philippe Maurine
    DATE: Design, Automation and Test in Europe, Mar 2016, Dresden, Germany. 2016. <http://www.date-conference.com/conference/session/5.3>
  20. On-Chip Fingerprinting of IC Topology for Integrity Verification
    Maxime Lecomte, Jacques Jean-Alain Fournier, Philippe Maurine
    DATE: Design, Automation and Test in Europe, Mar 2016, Dresden, Germany. 2016. <http://www.date-conference.com/conference/session/3.3>
  21. Body Biasing Injection Attacks in Practice
    Noemie Beringuier-Boher, Marc Lacruche, David El-Baze, Jean-Max Dutertre, Jean-Baptiste Rigaud, Philippe Maurine
    CS2: Cryptography and Security in Computing Systems, Jan 2016, Prague, Czech Republic. ACM, 3rd Workshop on Cryptography and Security in Computing Systems (CS2) in conjonction with 11th High Performance and Embedded Architecture and Compilation (HiPEAC) Conference., pp.49-54, 2016.

2015

  1. Thoroughly analyzing the use of ring oscillators for on-chip hardware trojan detection
    Maxime Lecomte, Philippe Maurine, Jacques Jean-Alain Fournier
    ReConFig: ReConFigurable Computing and FPGAs, Dec 2015, Mexico, Mexico. International Conference on ReConFigurable Computing and FPGAs, pp.1-6, 2015.
  2. Collision for Estimating SCA Measurement Quality and Related Applications
    Ibrahima Diop, Mathieu Carbone, Sébastien Ordas, Yanis Linge, Pierre Yvan Liardet, Philippe Maurine
    CARDIS: Smart Card Research and Advanced Applications, Nov 2015, Bochum, Germany. 14th International Conference, CARDIS 2015, Bochum, Germany, November 4-6, 2015. Revised Selected Papers, LNCS (9514), pp.143-157, 2016, Smart Card Research and Advanced Applications.
  3. Relevance of impedance spectroscopy for the monitoring of implant-induced fibrosis: A preliminary study
    Noëlle Lewis, C Lahuec, S Renaud, E Mcadams, P Bogonez-Franco, C Lethias, S Kellouche, F Carreiras, A Pinna, Aymeric Histace, M Boissiere, E Pauthe, I Lagroye, Fabien Soulier, Serge Bernard, S Binczak, Bertrand Granado, Patrick Garda, M Terosiet, Alexandre Goguin, Olivier Romain
    IEEE. BIOCAS: Biomedical Circuits and Systems, Oct 2015, Atlanta, United States. Proceedings of BIOCAS 2015 Conference, pp.1-4, 2015.
  4. EM Injection: Fault Model and Locality
    Sébastien Ordas, Ludovic Guillaume-Sage, Philippe Maurine
    FDTC: Fault Diagnosis and Tolerance in Cryptography, Sep 2015, Saint Malo, France. 2015 Workshop on Fault Diagnosis and Tolerance in Cryptography (FDTC), pp.3-13, 2015.
  5. Carbon nanotube interconnects for energy-efficient integrated circuits
    Aida Todri-Sanial
    TNT: Trends in Nanotechnology, Sep 2015, Toulouse, France. 16th International Conference on Trends in Nanotechnology (TNT2015), 2015.
  6. Collision Based Attacks in Practice
    Diop Ibrahima, Pierre-Yvan Liardet, Yanis Linge, Philippe Maurine
    DSD: Euromicro Conference on Digital System Design, Aug 2015, Madeire, Portugal. IEEE, Digital System Design (DSD), 2015 Euromicro Conference on, pp.367-374, 2015.
  7. Carbon-based Power Delivery Networks for nanoscale ICs: electrothermal performance analysis
    Alessandro Magnani, Massimiliano De Magistris, Aida Todri-Sanial, Antonio Maffucci
    IEEE-NANO: Nanotechnology, Jul 2015, Rome, Italy. IEEE, 15th IEEE International Conference on Nanotechnology, pp.416-419, 2016.
  8. Toward adaptation of ADCs to operating conditions through on-chip correction
    Vincent Kerzérho, Ludovic Guillaume-Sage, Florence Azaïs, Mariane Comte, Michel Renovell, Serge Bernard
    ISVLSI: IEEE Computer Society Annual Symposium on VLSI, Jul 2015, Montpellier, France. Proc. IEEE Computer Society Annual Symposium on VLSI (ISVLSI’15), pp.634-639, 2015.
  9. A framework for efficient implementation of analog/RF alternate test with model redundancy
    Syhem Larguech, Florence Azaïs, Serge Bernard, Mariane Comte, Vincent Kerzérho, Michel Renovell
    ISVLSI: IEEE Computer Society Annual Symposium on VLSI, Jul 2015, Montpellier, France. IEEE, Proc. IEEE Computer Society Annual Symposium on VLSI (ISVLSI’15), pp.621-626, 2015.
  10. On the Performance Exploration of 3D NoCs with Resistive-Open TSVs
    Charles Effiong, Vianney Lapotre, Abdoulaye Gamatié, Gilles Sassatelli, Aida Todri-Sanial, Khalid Latif
    ISVLSI: International Symposium on Very Large Scale Integration, Jul 2015, Montpellier, France. pp.579-584, 2015, Proceedings of the 2015 IEEE Computer Society Annual Symposium on VLSI (ISVLSI).
  11. In-silico Phantom Axon: Emulation of an Action Potential Propagating Along Artificial Nerve Fiber
    Olivier Rossel, Fabien Soulier, Serge Bernard, David Guiraud, Guy Cathébras
    ISVLSI: IEEE Computer Society Annual Symposium on VLSI, Jul 2015, Montpellier, France. 2015, Proceedings of 2015 IEEE Computer Society Annual Symposium on VLSI (ISVLSI). <10.1109/ISVLSI.2015.123>
  12. On Analysis of On-chip DC-DC Converters for Power Delivery Networks
    Ghizlane Mouslih, Aida Todri-Sanial, Pascal Nouet
    ISVLSI: IEEE Computer Society Annual Symposium on VLSI, Jul 2015, Montpellier, France. IEEE, IEEE Computer Society Annual Symposium on VLSI (ISVLSI), pp.557-560, 2015.
  13. A generic methodology for building efficient prediction models in the context of alternate testing
    Syhem Larguech, Florence Azaïs, Serge Bernard, Mariane Comte, Vincent Kerzérho, Michel Renovell
    IMSTW: International Mixed-Signals Test Workshop, Jun 2015, Paris, France. IEEE, 2015, Mixed-Signal Testing Workshop (IMSTW), 2015 20th International. <10.1109/IMS3TW.2015.7177873>
  14. Digital on-chip measurement circuit for built-in phase noise testing
    Stéphane David-Grignot, Florence Azaïs, Laurent Latorre, François Lefevre
    IMSTW: International Mixed-Signals Test Workshop, Jun 2015, Paris, France. IEEE, 2015, Mixed-Signal Testing Workshop (IMSTW), 2015 20th International. <10.1109/IMS3TW.2015.7177880>
  15. Une pedagogie par projet pour des etudiants acteurs et auteurs de leur apprentissage
    Beatrice Pradarelli, Pascal Nouet, Laurent Latorre
    QPES: Questions de Pédagogie dans l’Enseignement Supérieur, Jun 2015, Brest, France. 2015. <http://www.colloque-pedagogie.org/?q=node/5>
  16. An architecture-level cache simulation framework supporting advanced PMA STT-MRAM
    Bi Wu, Yuanqing Cheng, Ying Wang, Aida Todri-Sanial, Guangyu Sun, Lionel Torres, Weisheng Zhao
    NANOARCH: Nanoscale Architectures, Jun 2015, Boston, MA, United States. Nanoscale Architectures (NANOARCH), 2015 IEEE/ACM International Symposium on, pp.7-12, 2015.
  17. A New Technique for Low-Cost Phase Noise Production Testing from 1-bit Signal Acquisition
    Stéphane David-Grignot, Florence Azaïs, Laurent Latorre, François Lefevre
    ETS: European Test Symposium, May 2015, Cluj-Napoca, Romania. IEEE, Proc. IEEE European Test Symposium 2015 (ETS'15), pp.1-6, 2015.
  18. A body-biasing of readout circuit for STT-RAM with improved thermal reliability
    Lun Yang, Yuanqing Cheng, Yuhao Wang, Hao Yu, Weisheng Zhao, Aida Todri-Sanial
    ISCAS: International Symposium on Circuits and Systems, May 2015, Lisbon, Portugal. IEEE, IEEE International Symposium on Circuits and Systems, pp.1530-1533, 2015.
  19. A node clustering reduction scheme for power grids electrothermal analysis
    Alessandro Magnani, M. De Magistris, Antonio Maffucci, Aida Todri-Sanial
    SPI: Signal and Power Integrity, May 2015, Berlin, Germany. Signal and Power Integrity (SPI), 2015 IEEE 19th Workshop on, pp.1-4, 2015.
  20. An ultra-low-power front-end for differential capacitive sensors
    Patcharee Kongpark, Frédérick Mailly, Laurent Latorre, Pascal Nouet
    DTIP: Design, Test, Integration and Packaging, Apr 2015, Montpellier, France. IEEE, 2015, Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP2015). <10.1109/DTIP.2015.7160964>
  21. MEMS based Inertial Measurement Units
    Gaurav Chatterjee, Laurent Latorre, Frédérick Mailly, Pascal Nouet, Nacim Hachelef, Coumar Oudea
    DTIP: Design, Test, Integration and Packaging, Apr 2015, Montpellier, France. IEEE, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, pp.1-5, 2015.
  22. Embedded test instrument for on-chip phase noise evaluation of analog/IF signals
    Florence Azaïs, Stéphane David-Grignot, Laurent Latorre, François Lefevre
    DDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2015, Belgrade, Serbia. IEEE, Proc. of the 18th IEEE Workshop on Design and Diagnostics of Electronic Circuits and Systems (DDECS'15), pp.237-242, 2015.
  23. Exploring the limit of ENG spatio-temporal filtering for velocity-selectivity
    Mariam Abdallah, Olivier Rossel, Serge Bernard, Fabien Soulier, Guy Cathébras
    NER: Neural Engineering, Apr 2015, Montpellier, France. 2015, 7th International IEEE EMBS Neural Engineering Conference.
  24. Statistical Energy Study for 28nm FDSOI Devices
    Kheirallah Rida, Jean-Marc Galliere, Aida Todri-Sanial, Gilles Ducharme, Nadine Azemard
    EuroSimE: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2015, Budapest, Hungary. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on, 2015. <10.1109/EuroSimE.2015.7103149>
  25. A digital technique for the evaluation of SSB phase noise of analog/RF signals
    Florence Azaïs, Stéphane David-Grignot, François Lefevre, Laurent Latorre
    LATS: Latin-American Test Symposium, Mar 2015, Puerto Vallarta, Mexico. IEEE, 2015, Test Symposium (LATS), 2015 16th Latin-American. <10.1109/LATW.2015.7102407>
  26. Interest of MIA in frequency domain?
    Mathieu Carbone, Michel Agoyan, Yannick Teglia, Gilles Ducharme, Philippe Maurine
    CS2'2015: 2nd Workshop on Cryptography and Security in Computing Systems, Jan 2015, Amtersdam, Netherlands. Proceedings of the Second Workshop on Cryptography and Security in Computing Systems, Proceedings of the Second Workshop on Cryptography and Security in Computing Systems. <10.1145/2694805.2694812>

2014

  1. Evidence of a larger EM-induced fault model
    Sébastien Ordas, Ludovic Guillaume-Sage, Karim Tobich, Jean-Max Dutertre, Philippe Maurine
    CARDIS: Smart Card Research and Advanced Applications, Nov 2014, Paris, France. 13th Smart Card Research and Advanced Application Conference, LNCS (8968), pp.245-259, 2015, Smart Card Research and Advanced Applications.
  2. CMOS implementation of a 3-axis thermal convective accelerometer
    Frédérick Mailly, Huy Binh Nguyen, Laurent Latorre, Pascal Nouet
    IEEE SENSORS 2014, Nov 2014, Valencia, Spain. IEEE, Sensors Conference 2014, pp.1471-1474, 2014.
  3. Low-cost phase noise testing of complex RF ICs using standard digital ATE
    Stephane David-Grignot, Florence Azaïs, Laurent Latorre, François Lefevre
    ITC: International Test Conference, Oct 2014, Seattle, WA, United States. IEEE, 2014. <10.1109/TEST.2014.7035301>
  4. Electromagnetic analysis, deciphering and reverse engineering of integrated circuits (E-MATA HARI)
    Laurent Chusseau, Rachid Omarouayache, Jérémy Raoult, Sylvie Jarrix, Philippe Maurine, Karim Tobich, Alexandre Boyer, Bertrand Vrignon, John Shepherd, Thanh-Ha Le, Maël Berthier, Lionel Rivière, Bruno Robisson, Anne-Lise Ribotta
    VLSI-SoC: Very Large Scale Integration - System-on-Chip, Oct 2014, Playa del Carmen, Mexico. 22nd International Conference on Very Large Scale Integration, pp.1-6, 2014.
  5. ElectroMagnetic Analysis and Fault Injection onto Secure Circuits
    Paolo Maistri, Regis Leveugle, Lilian Bossuet, Alain Aubert, Viktor Fischer, Bruno Robisson, Nicolas Moro, Philippe Maurine, Jean-Max Dutertre, Mathieu Lisart
    VLSI-SoC: Very Large Scale Integration - System-on-Chip, Oct 2014, Mexico, Mexico. 22nd International Conference on Very Large Scale Integration, 2014. <10.1109/VLSI-SoC.2014.7004182>
  6. Stochastic model for phase noise measurement from 1-bit signal acquisition
    Stephane David-Grignot, Florence Azaïs, François Lefevre, Laurent Latorre
    IMS3TW'14: International Mixed-Signals, Sensors, and Systems Test Workshop, Sep 2014, Porto Alegre, Brazil. IEEE, pp.1-6.
  7. Study of adaptive tuning strategies for Near Field Communication (NFC) transmitter module
    Mouhamadou Dieng, Florence Azaïs, Mariane Comte, Serge Bernard, Vincent Kerzérho, Michel Renovell, Thibault Kervaon, Paul-Henri Pugliesi-Conti
    IMS3TW'14: International Mixed-Signals, Sensors, and Systems Test Workshop, Sep 2014, Porto ALegre, Brazil. IEEE, pp.1-6.
  8. FINMINA: a French national project to promote Innovation in Higher Education in Microelectronics and Nanotechnologies
    Olivier Bonnaud, Laurent Fesquet, Pascal Nouet, Tayeb Mohammed-Brahim
    Information Technology Based Higher Education and Training ITHET 2014, Sep 2014, York, United Kingdom.
  9. Real-Time Testing of 90nm COTS SRAMs at Concordia Station in Antarctica
    Georgios Tsiligiannis, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Aida Todri-Sanial, Arnaud Virazel, Philippe Cocquerez, Jean-Luc Autran, Antonio Litterio, Frédéric Wrobel, Frédéric Saigné
    NSREC: Nuclear and Space Radiation Effects Conference, Jul 2014, Paris, France. IEEE Nuclear & Space Radiation Effects Conference (NSREC 2014), 2014. <http://ieee-npss.org/wp-content/uploads/2014/03/2014-NSREC.pdf>
  10. Efficient Dynamic Test Methods for COTS SRAMs Under Heavy Ion Irradiation
    Georgios Tsiligiannis, Luigi Dilillo, Viyas Gupta, Alberto Bosio, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Helmut Puchner, Alexandre Bosser, Arto Javanainen, Ari Virtanen, Frédéric Wrobel, Laurent Dusseau, Frédéric Saigné
    NSREC: Nuclear and Space Radiation Effects Conference, Jul 2014, Paris, France. IEEE Nuclear & Space Radiation Effects Conference (NSREC 2014), 2014.
  11. A Delay Probability Metric for Input Pattern Ranking Under Process Variation and Supply Noise
    Anu Asokan, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Serge Pravossoudovitch, Arnaud Virazel
    ISVLSI: IEEE Computer Society Annual Symposium on VLSI, Jul 2014, Tampa, FL, United States. VLSI (ISVLSI), 2014 IEEE Computer Society Annual Symposium on, pp.226-231, 2014.
  12. Solutions for the self-adaptation of communicating systems in operation
    Martin Andraud, Anthony Deluthault, Mouhamadou Dieng, Florence Azaïs, Serge Bernard, Philippe Cauvet, Mariane Comte, Thibault Kervaon, Vincent Kerzérho, Salvador Mir, Paul-Henri Pugliesi-Conti, Michel Renovell, Fabien Soulier, Emmanuel Simeu, Haralampos-G Stratigopoulos
    IOLTS: International International On-line Test Symposium, Jul 2014, Platja d’Aro, Spain. IEEE Computer Society, 20th International International On-line Test Symposium, pp.234-239, 2014.
  13. Methodology for Self-Adaptation of Electronic Medical Devices: Application to an Intraocular Pressure Sensor
    Anthony Deluthault, Fabien Soulier, Serge Bernard, Vincent Kerzérho, Luc Menzenge, Philippe Cauvet
    IOLTS'14: 20th International On-Line Testing Symposium, Jul 2014, Platja d'Aro, Spain. IEEE, Special Session 4 – Solutions for the self-adaptation of communicating systems in operation. <http://tima.imag.fr/conferences/IOLTS/iolts14/>
  14. Self-Adaptive NFC Systems
    Vincent Kerzérho, Florence Azaïs, Mouhamadou Dieng, Mariane Comte, Serge Bernard, Michel Renovell, Paul-Henri Pugliesi-Conti, Thibault Kervaon
    IOLTS: International On-Line Testing Symposium, Jul 2014, Platja d'Aro, Spain. IEEE, 20th IEEE International On-Line Testing Symposium, 2014, Special Session 4 – Solutions for the self-adaptation of communicating systems in operation.
  15. Simplified review of DCDC switching noise and spectrum contents
    Adnan Fares, Sami Ajram, Guy Cathébras
    PRIME: Ph.D. Research in Microelectronics and Electronics, Jun 2014, Grenoble, France. Ph.D. Research in Microelectronics and Electronics (PRIME), 2014 10th Conference on, pp.1-4, 2014.
  16. Performance exploration of partially connected 3D NoCs under manufacturing variability
    Anelise Kologeski, Fernanda Lima Kastensmidt, Vianney Lapotre, Abdoulaye Gamatié, Gilles Sassatelli, Aida Todri-Sanial
    NEWCAS: International New Circuits and Systems Conference, Jun 2014, Trois-Rivieres, QC, Canada. IEEE, New Circuits and Systems Conference (NEWCAS), 2014 IEEE 12th International, pp.61-64, 2014.
  17. Phase noise measurement on IF analog signals using standard digital ATE resources
    Stephane David-Grignot, Laurent Latorre, Florence Azaïs, François Lefevre
    NEWCAS: New Circuits and Systems, Jun 2014, Trois-Rivieres, Canada. IEEE, IEEE 12th International New Circuits and Systems Conference, pp.121-124, 2014.
  18. Investigations on alternate analog/RF test with model redundancy
    Haithem Ayari, Florence Azaïs, Serge Bernard, Vincent Kerzérho, Syhem Larguech, Mariane Comte, Michel Renovell
    STEM Workshop, May 2014, Paderborn, Germany. 1st Workshop on Statistical Test Methods, 2014. <http://www.ets14.de/pages/workshops/stem-workshop.php>
  19. iBoX — Jitter based Power Supply Noise sensor
    Miroslav Valka, Alberto Bosio, Luigi Dilillo, Aida Todri-Sanial, Arnaud Virazel, Patrick Girard, Philippe Debaud, Stephane Guilhot
    ETS: European Test Symposium, May 2014, Paderborn, United States. Test Symposium (ETS), 2014 19th IEEE European, pp.1-2, 2014.
  20. A Comprehensive Evaluation of Functional Programs for Power-Aware Test
    Aymen Touati, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Paolo Bernardi
    NATW: North Atlantic Test Workshop, May 2014, Johnson City, NY, United States. IEEE, Test Workshop (NATW), 2014 IEEE 23rd North Atlantic, pp.69-72, 2014.
  21. A frequency leakage model for SCA
    Sébastien Tiran, Sébastien Ordas, Yannick Teglia, Michel Agoyan, Philippe Maurine
    HOST'2014: International Symposium on Hardware-Oriented Security and Trust, May 2014, Arlington, VA, United States. IEEE, Proceedings of the 2014 IEEE International Symposium on Hardware-Oriented Security and Trust (HOST), pp.97-100, Hardware-Oriented Security and Trust.
  22. Timing-aware ATPG for critical paths with multiple TSVs
    Carolina Metzler, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel
    DDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2014, Warsaw, Poland. IEEE, Design and Diagnostics of Electronic Circuits & Systems, 17th International Symposium on, pp.116-121, 2014.
  23. Protecting combinational logic in pipelined microprocessor cores against transient and permanent faults
    Imran Wali, Arnaud Virazel, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial
    DDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2014, Warsaw, Poland. Design and Diagnostics of Electronic Circuits Systems, 17th International Symposium on, pp.223-225, 2014.
  24. Path delay test in the presence of multi-aggressor crosstalk, power supply noise and ground bounce
    Anu Asokan, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Serge Pravossoudovitch, Arnaud Virazel
    DDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2014, Warsaw, Poland. IEEE, Design and Diagnostics of Electronic Circuits & Systems, 17th International Symposium on, pp.207-212, 2014.
  25. Test and diagnosis of power switches
    Miroslav Valka, Alberto Bosio, Luigi Dilillo, Aida Todri-Sanial, Arnaud Virazel, Patrick Girard, Philippe Debaud, Stephane Guilhot
    DDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2014, Warsaw, Poland. Design and Diagnostics of Electronic Circuits Systems, 17th International Symposium on, pp.213-218, 2014.
  26. An intra-cell defect grading tool
    Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Stefano Bernabovi, Paolo Bernardi
    DDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2014, Warsaw, Poland. Design and Diagnostics of Electronic Circuits & Systems, 17th International Symposium on, pp.298-301, 2014.
  27. TSV aware timing analysis and diagnosis in paths with multiple TSVs
    Carolina Metzler, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel
    ISVLSI: IEEE Computer Society Annual Symposium on VLSI, Apr 2014, Napa, CA, United States. VLSI Test Symposium (VTS), 2014 IEEE 32nd, pp.1-6, 2014.
  28. On Adaptive Bandwidth Selection for Efficient MIA
    Mathieu Carbone, Sébastien Tiran, Sébastien Ordas, Michel Agoyan, Yannick Teglia, Gilles R. Ducharme, Philippe Maurine
    COSADE'2014: 5th International Workshop on Constructive Side-Channel Analysis and Secure Design, Apr 2014, Paris, France. Constructive Side-Channel Analysis and Secure Design, pp.82-97, 2014, Lecture Notes in Computer Science.
  29. Attacking Randomized Exponentiations Using Unsupervised Learning
    Guilherme Perin, Laurent Imbert, Lionel Torres, Philippe Maurine
    COSADE: Constructive Side-Channel Analysis and Secure Design, Apr 2014, Paris, France. 5th International Workshop on Constructive Side-Channel Analysis and Secure Design, LNCS (8622), pp.144-160, 2014, Constructive Side-Channel Analysis and Secure Design.
  30. Monitoring of particle deposition in cleanrooms: State-of-the-art
    Pascal Nouet, Nina Menant, Delphine Faye, Xavier Lafontan, Djemel Lellouchi
    DTIP: Design, Test, Integration and Packaging, Apr 2014, Cannes, France. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, pp.368-371, 2014.
  31. Direct digital synthesiser (DDS) design parameters optimisation for vibrating MEMS sensors: Optimisation of phase accumulator, Look-Up Table (LUT) and Digital to Analog Converter (DAC) sizes
    Baptiste Marechal, Jean Guérard, Raphael Levy, Olivier Le Traon, Frédérick Mailly, Pascal Nouet
    DTIP: Design, Test, Integration and Packaging, Apr 2014, Cannes, France. IEEE, pp.1-5, 2014, Proceedings of the Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP2014).
  32. New implementions of predictive alternate analog/RF test with augmented model redundancy
    Haithem Ayari, Florence Azaïs, Serge Bernard, Mariane Comte, Vincent Kerzérho, Michel Renovell
    DATE: Design, Automation and Test in Europe, Mar 2014, Dresden, Germany. 2014. <10.7873/DATE2014.144>
  33. Efficiency of a glitch detector against electromagnetic fault injection
    Loic Zussa, Amine Dehbaoui, Karim Tobich, Jean-Max Dutertre, Philippe Maurine, Ludovic Guillaume-Sage, Jessy Clédière, Assia Tria
    DATE: Design, Automation and Test in Europe, Mar 2014, Dresden, Germany. IEEE, pp.1-6, 2014, Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014.
  34. Evaluation of indirect measurement selection strategies in the context of analog/RF alternate testing
    Syhem Larguech, Florence Azaïs, Serge Bernard, Vincent Kerzérho, Mariane Comte, Michel Renovell
    LATW: Latin American Test Workshop, Mar 2014, Fortaleza, Brazil. 15th IEEE Latin American Test Workshop, pp.1-6, 2014.
  35. Power supply noise-aware workload assignments for homogeneous 3D MPSoCs with thermal consideration
    Yuanqing Cheng, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel
    ASP-DAC: Asia and South Pacific Design Automation Conference, Jan 2014, Singapore, Singapore. 19th Asia and South Pacific Design Automation Conference, 2014. <10.1109/ASPDAC.2014.6742948>
  36. Power supply noise-aware workload assignments for homogeneous 3D MPSoCs with thermal consideration
    Yuanqing Cheng, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel
    ASP-DAC: Asia and South Pacific Design Automation Conference, Jan 2014, Singapore, Singapore. pp.544-549, 2014, Design Automation Conference (ASP-DAC), 2014 19th Asia and South Pacific.

2013

  1. Countermeasures against EM analysis for a secured FPGA-based AES implementation
    Paolo Maistri, Sébastien Tiran, Philippe Maurine, Israel Koren, Régis Leveugle
    ReConFig'13: International Conference on ReConFigurable Computing and FPGAs, Dec 2013, Cancun, Mexico. IEEE Computer Society, pp.1-6, 2013.
  2. Practical Analysis of RSA Countermeasures Against Side-Channel Electromagnetic Attacks
    Guilherme Perin, Laurent Imbert, Lionel Torres, Philippe Maurine
    CARDIS: Smart Card Research and Advanced Applications, Nov 2013, Berlin, Germany. Springer, 12th Smart Card Research and Advanced Application Conference, LNCS (8419), pp.200-215, 2013.
  3. Adaptive Source Bias for Improved Resistive-Open Defect Coverage during SRAM Testing
    Ioana Vatajelu, Luigi Dilillo, Alberto Bosio, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Nabil Badereddine
    ATS: Asian Test Symposium, Nov 2013, Jiaosi Township, Taiwan. pp.109-114, 2013.
  4. Performance Characterization of TAS-MRAM Architectures in Presence of Capacitive Defects
    João Azevedo, Arnaud Virazel, Yuanqing Cheng, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Jérémy Alvarez-Hérault
    VALID: Advances in System Testing and Validation Lifecycle, Oct 2013, Venice, Italy. 5th International Conference on Advances in System Testing and Validation Lifecycle, pp.39-44, 2013.
  5. On the correlation between Static Noise Margin and Soft Error Rate evaluated for a 40nm SRAM cell
    Ioana Vatajelu, Georgios Tsiligiannis, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Aida Todri-Sanial, Arnaud Virazel, Frédéric Wrobel, Frédéric Saigné
    DFT: Defect and Fault Tolerance in VLSI and Nanotechnology Systems, Oct 2013, New York, United States. Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), 2013 IEEE International Symposium on, pp.143-148, 2013.
  6. SEU Monitoring in Mixed-Field Radiation Environments of Particle Accelerators
    Georgios Tsiligiannis, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Aida Todri-Sanial, Arnaud Virazel, Julien Mekki, Markus Brugger, Frédéric Wrobel, Frédéric Saigné
    RADECS: Radiation and Its Effects on Components and Systems, Sep 2013, Oxford, United Kingdom. 14th European Conference on Radiation and Its Effects on Components and Systems, pp.1-4, 2013.
  7. Multiple-Cell-Upsets on a commercial 90nm SRAM in Dynamic Mode
    Georgios Tsiligiannis, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Aida Todri-Sanial, Arnaud Virazel, Christopher Frost, Frédéric Wrobel, Frédéric Saigné
    RADECS: Radiation and Its Effects on Components and Systems, Sep 2013, Oxford, United Kingdom. 14th European Conference on Radiation and Its Effects on Components and Systems, pp.1-4, 2013.
  8. Improving Defect Localization Accuracy by means of Effect-Cause Intra-Cell Diagnosis at Transistor Level
    Zhenzhou Sun, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Etienne Auvray
    SDD: Silicon Debug and Diagnosis, Sep 2013, Anaheim, CA, United States. 8th IEEE International Workshop on Silicon Debug and Diagnosis, 2013. <http://sdd.tttc-events.org/13/>
  9. A Comparative Analysis of Indirect Measurement Selection Strategies for Analog/RF Alternate Testing
    Syhem Larguech, Florence Azaïs, Serge Bernard, Vincent Kerzérho, Mariane Comte, Michel Renovell
    3rd IEEE International Workshop on Test and Validation of High Speed Analog Circuits, Sep 2013, Anaheim, CA, United States. 2013.
  10. On the Reuse of Read and Write Assist Circuits to Improve Test Efficiency in Low-Power SRAMs
    Leonardo Zordan, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Nabil Badereddine
    ITC: International Test conference, Sep 2013, Anaheim, CA, United States. pp.1-10, 2013.
  11. Temperature and Fast Voltage On-Chip Monitoring using Low-Cost Digital Sensors
    Lionel Vincent, Philippe Maurine, Edith Beigne, Suzanne Lesecq, Julien Mottin
    VARI: Workshop on CMOS Variability, Sep 2013, Karlsruhe, Germany. 2013, 4th International Workshop on CMOS Variability.
  12. Voltage Spikes on the Substrate to Obtain Timing Faults
    Karim Tobich, Philippe Maurine, Pierre-Yvan Liardet, Mathieu Lisart, Thomas Ordas
    DSD: Digital System Design, Sep 2013, Santander, Spain. 16th Euromicro Conference Series on Digital System Design, pp.483-486, 2013, Digital System Design (DSD).
  13. Electromagnetic Analysis on RSA Algorithm Based on RNS
    Guilherme Perin, Laurent Imbert, Lionel Torres, Philippe Maurine
    DSD: Digital System Design, Sep 2013, Santander, Spain. IEEE, 16th Euromicro Conference on Digital System Design, pp.345-352, 2013, Digital System Design.
  14. Magnetic Microprobe design for EM fault attack
    Rachid Omarouayache, Jérémy Raoult, Sylvie Jarrix, Laurent Chusseau, Philippe Maurine
    EMC EUROPE: Electromagnetic Compatibility, Sep 2013, Bruges, Belgium. IEEE International Symposium on Electromagnetic Compatibility, 2013, EMC EUROPE.
  15. A novel method to mitigate TSV electromigration for 3D ICs
    Yuanqing Cheng, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel, Pascal Vivet, Marc Belleville
    ISVLSI: IEEE Computer Society Annual Symposium on VLSI, Aug 2013, Natal, Brazil. pp.121-126, 2013.
  16. SRAM Soft Error Rate Evaluation Under Atmospheric Neutron Radiation and PVT variations
    Georgios Tsiligiannis, Ioana Vatajelu, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Aida Todri-Sanial, Arnaud Virazel, Frédéric Wrobel, Frédéric Saigné
    IOLTS: International On-Line Testing Symposium, Jul 2013, Chania, Crete, Greece. On-Line Testing Symposium (IOLTS), 2013 IEEE 19th International, pp.145-150, 2013.
  17. Temperature Impact on the Neutron SER of a Commercial 90nm SRAM
    Georgios Tsiligiannis, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Aida Todri-Sanial, Arnaud Virazel, Christopher Frost, Frédéric Wrobel, Frédéric Saigné
    NSREC: Nuclear and Space Radiation Effects Conference, Jul 2013, San Francisco, Ca, United States. IEEE, pp.1-4, 2013.
  18. Mitigate TSV Electromigration for 3D ICs - From the Architecture Perspective
    Yuanqing Cheng, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel, Pascal Vivet, Marc Belleville
    International Symposium on VLSI, Natale, Brazil. pp.6, 2013.
  19. Evaluating An SEU Monitor For Mixed-Field Radiation Environments
    Georgios Tsiligiannis, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Aida Todri-Sanial, Arnaud Virazel, Julien Mekki, Markus Brugger, Frédéric Wrobel, Frédéric Saigné
    iWoRID: International Workshop on Radiation Imaging Detectors, Jun 2013, Paris, France. 15th International Workshops on Radiation Imaging Detectors, 2013. <http://www.synchrotron-soleil.fr/Workshops/2013/IWORID2013>
  20. Worst-Case Power Supply Noise and Temperature Distribution Analysis for 3D PDNs with Multiple Clock Domains
    Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Serge Pravossoudovitch, Arnaud Virazel
    NEWCAS: New Circuits and Systems, Jun 2013, Paris, France. 11th International IEEE Conference on New Circuits and Systems, 2013. <10.1109/NEWCAS.2013.6573628>
  21. Accurate and Efficient Analytical Electrical Model of Antenna for NFC Applications
    Mouhamadou Dieng, Mariane Comte, Serge Bernard, Vincent Kerzérho, Florence Azaïs, Michel Renovell, Thibault Kervaon, Paul-Henri Pugliesi-Conti
    NEWCAS: New Circuits and Systems, Jun 2013, Paris, France. IEEE, IEEE 11th International New Circuits and Systems Conference, pp.137-141, 2013.
  22. Characterization of an SRAM Based Particle Detector For Mixed-Field Radiation Environments
    Georgios Tsiligiannis, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Aida Todri-Sanial, Arnaud Virazel, Julien Mekki, Markus Brugger, Jean-Roch Vaillé, Frédéric Wrobel, Frédéric Saigné
    IWASI: International Workshop on Advances in Sensors and Interfaces, Jun 2013, Bari, Italy. 5th IEEE International Workshop on Advances in Sensors and Interfaces, pp.75-80, 2013.
  23. Low-noise and Low-power Front-end for True-tripolar ENG Amplifier
    Mariam Abdallah, Fabien Soulier, Serge Bernard, Lionel Gouyet, Guy Cathébras
    IFESS: International Functional Electrical Stimulation Society, Jun 2013, San Sebastian, Spain. 18th International Conference of Functional Electrical Stimulation, pp.217-219, 2013.
  24. Analyzing Resistive-Open Defects in SRAM Core-Cell under the Effect of Process Variability
    Ioana Vatajelu, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Nabil Badereddine
    ETS: European Test Symposium, May 2013, Avignon, France. Test Symposium (ETS), 2013 18th IEEE European, pp.1-6, 2013.
  25. Computing Detection Probability of Delay Defects in Signal Line TSVs
    Carolina Metzler, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel, Pascal Vivet, Marc Belleville
    ETS: European Test Symposium, May 2013, Avignon, France. Test Symposium (ETS), 2013 18th IEEE, 2013. <10.1109/ETS.2013.6569349>
  26. Analyzing resistive-open defects in SRAM core-cell under the effect of process variability
    Ioana Vatajelu, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Nabil Badereddine
    ETS: European Test Symposium, May 2013, Avignon, France. 18th IEEE European Test Symposium, 2013. <10.1109/ETS.2013.6569373>
  27. An evaluation of an AES implementation protected against EM analysis
    Paolo Maistri, Sébastien Tiran, Philippe Maurine, Israel Koren, Régis Leveugle
    GLSVLSI: Great Lakes Symposium on VLSI, May 2013, Paris, France. ACM New York, NY, USA, 23rd ACM International Conference on Great Lakes Symposium on VLSI, pp.317-318, 2013.
  28. A Built-in Scheme for Testing and Repairing Voltage Regulators of Low-Power SRAMs
    Leonardo Zordan, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Nabil Badereddine
    VTS: VLSI Test Symposium, Apr 2013, Berkeley, CA, United States. IEEE 31st VLSI Test Symposium, pp.1-6, 2013.
  29. Design of a Monolithic 3-axis Thermal Convective Accelerometer
    Huy Binh Nguyen, Frédérick Mailly, Laurent Latorre, Pascal Nouet
    DTIP: Design, Test, Integration and Packaging, Apr 2013, Barcelona, Spain. Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, pp.235-238, 2013.
  30. Self-test and self-calibration of a MEMS convective accelerometer
    Ahmed Rekik, Florence Azaïs, Frédérick Mailly, Pascal Nouet, Mohamed Masmoudi
    DTIP: Design, Test, Integration & Packaging of MEMS/MOEMS, Apr 2013, Barcelona, Spain. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 on, Barcelona, 2013, pp. 1-4. keywords: ,, pp.239-242, 2013.
  31. Fast and Accurate Electro-Thermal Analysis of Three-Dimensional Power Delivery Networks
    Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel
    EuroSimE: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wroclaw, Poland. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on, pp.1-4, 2013.
  32. Analyzing the effect of concurrent variability in the core cells and sense amplifiers on SRAM read access failures
    Ioana Vatajelu, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Nabil Badereddine
    DTIS: Design and Technology of Integrated Systems in Nanoscale Era, Mar 2013, Abu Dhabi, United Arab Emirates. 8th International Conference on Design Technology of Integrated Systems in Nanoscale Era, pp.39-44, 2013.
  33. Test Solution for Data Retention Faults in Low-Power SRAMs
    Leonardo Zordan, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Nabil Badereddine
    EDA Association. DATE: Design, Automation and Test in Europe, Mar 2013, Grenoble, France. Design, Automation & Test in Europe Conference & Exhibition, pp.442-447, 2013.
  34. Effect-Cause Intra-Cell Diagnosis at Transistor Level
    Zhenzhou Sun, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel, Etienne Auvray
    ISQED: International Symposium on Quality Electronic Design, Mar 2013, Santa Clara, CA, United States. 14th International Symposium on Quality Electronic Design, pp.460-467, 2013.

Mots-clés

Conception de circuits intégrés, analogiques, mixtes, numériques, CMOS, technologie émergentes, MEMS, modélisation physique, conception statistique, monitoring du vivant, sécurité des composants.

Dernière mise à jour le 27/06/2018