23rd edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in two main Conferences. Due to the sanitary crisis, DTIP will be online in 2021. We are working hard to offer the most imaginative and technically efficient solutions to allow all attendees to « meet » the DTIP community as usual…
accueil
Giannos Stamoulis mis à l’honneur dans CNRS Sciences Informatiques
Lauréat d’un accessit du prix de thèse Gilles Kahn 2024, remis conjointement avec les travaux de Mathieu Even sur l’apprentissage fédéré, notamment sur des données privées, Giannos Stamoulis est
14 octobre 2025
