23rd edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in two main Conferences. Due to the sanitary crisis, DTIP will be online in 2021. We are working hard to offer the most imaginative and technically efficient solutions to allow all attendees to « meet » the DTIP community as usual…
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Nouveau livre de Ahmed Chemori publié chez Elsevier : « Control of Underactuated Mechanical Systems »
Ce livre commence par les avancées dans le domaine des systèmes mécaniques sous-actionnés, introduisant des concepts clés tels que la stabilisation et la génération de
13 juin 2025
