23rd edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in two main Conferences. Due to the sanitary crisis, DTIP will be online in 2021. We are working hard to offer the most imaginative and technically efficient solutions to allow all attendees to « meet » the DTIP community as usual…
accueil
Ahmed Chemori, invité par l’ambassadrice de France au Mexique
Dans le cadre de la deuxième école d’été sur la commande des systèmes robotiques complexes, qui s’est déroulée au CINVESTAV du 21 au 24 avril,
28 avril 2025
