23rd edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in two main Conferences. Due to the sanitary crisis, DTIP will be online in 2021. We are working hard to offer the most imaginative and technically efficient solutions to allow all attendees to “meet” the DTIP community as usual…
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Participation de Madalina Croitoru le 21 Mai 2024 à l’Hôtel de Ville de Montpellier
Afin de faire valoir la place des Femmes dans le secteur du Numérique : la Région Académique Occitanie, Femmes@Numérique, les acteurs de l’emploi et de